#include <step_pcb_model.h>

Public Member Functions
	STEP_PCB_MODEL (const wxString &aPcbName, REPORTER *aReporter)

virtual	~STEP_PCB_MODEL ()

void	SpecializeVariant (OUTPUT_FORMAT aVariant)

bool	AddPadShape (const PAD aPad, const VECTOR2D &aOrigin, bool aVia, SHAPE_POLY_SET aClipPolygon=nullptr)

bool	AddHole (const SHAPE_SEGMENT &aShape, int aPlatingThickness, PCB_LAYER_ID aLayerTop, PCB_LAYER_ID aLayerBot, bool aVia, const VECTOR2D &aOrigin, bool aCutCopper, bool aCutBody)

bool	AddBarrel (const SHAPE_SEGMENT &aShape, PCB_LAYER_ID aLayerTop, PCB_LAYER_ID aLayerBot, bool aVia, const VECTOR2D &aOrigin, const wxString &aNetname)

bool	AddPolygonShapes (const SHAPE_POLY_SET *aPolyShapes, PCB_LAYER_ID aLayer, const VECTOR2D &aOrigin, const wxString &aNetname)

bool	AddComponent (const std::string &aFileName, const std::string &aRefDes, bool aBottom, VECTOR2D aPosition, double aRotation, VECTOR3D aOffset, VECTOR3D aOrientation, VECTOR3D aScale, bool aSubstituteModels=true)

void	SetCopperColor (double r, double g, double b)

void	SetPadColor (double r, double g, double b)

void	SetEnabledLayers (const LSET &aLayers)

void	SetFuseShapes (bool aValue)

void	SetSimplifyShapes (bool aValue)

void	SetStackup (const BOARD_STACKUP &aStackup)

void	SetNetFilter (const wxString &aFilter)

void	OCCSetMergeMaxDistance (double aDistance=OCC_MAX_DISTANCE_TO_MERGE_POINTS)

bool	CreatePCB (SHAPE_POLY_SET &aOutline, VECTOR2D aOrigin, bool aPushBoardBody)

bool	MakeShapes (std::vector< TopoDS_Shape > &aShapes, const SHAPE_POLY_SET &aPolySet, bool aConvertToArcs, double aThickness, double aZposition, const VECTOR2D &aOrigin)
	Convert a SHAPE_POLY_SET to TopoDS_Shape's (polygonal vertical prisms, or flat faces)

bool	MakeShapeAsThickSegment (TopoDS_Shape &aShape, VECTOR2D aStartPoint, VECTOR2D aEndPoint, double aWidth, double aThickness, double aZposition, const VECTOR2D &aOrigin)
	Make a segment shape based on start and end point.

bool	MakePolygonAsWall (TopoDS_Shape &aShape, SHAPE_POLY_SET &aPolySet, double aHeight, double aZposition, const VECTOR2D &aOrigin)
	Make a polygonal shape to create a vertical wall.

bool	WriteSTEP (const wxString &aFileName, bool aOptimize, bool compress)

bool	WriteBREP (const wxString &aFileName)

bool	WriteXAO (const wxString &aFileName)

bool	WriteGLTF (const wxString &aFileName)
	Write the assembly in binary GLTF Format.

bool	WritePLY (const wxString &aFileName)

bool	WriteSTL (const wxString &aFileName)

Private Member Functions
bool	isBoardOutlineValid ()

void	getLayerZPlacement (const PCB_LAYER_ID aLayer, double &aZPos, double &aThickness)

void	getCopperLayerZPlacement (const PCB_LAYER_ID aLayer, double &aZPos, double &aThickness)

void	getBoardBodyZPlacement (double &aZPos, double &aThickness)

bool	getModelLabel (const std::string &aFileNameUTF8, VECTOR3D aScale, TDF_Label &aLabel, bool aSubstituteModels, wxString *aErrorMessage=nullptr)
	Load a 3D model data.

bool	getModelLocation (bool aBottom, VECTOR2D aPosition, double aRotation, VECTOR3D aOffset, VECTOR3D aOrientation, TopLoc_Location &aLocation)

bool	readIGES (Handle(TDocStd_Document) &aDoc, const char *aFname)

bool	readSTEP (Handle(TDocStd_Document) &aDoc, const char *aFname)

bool	readVRML (Handle(TDocStd_Document) &aDoc, const char *aFname)

bool	performMeshing (Handle(XCAFDoc_ShapeTool) &aShapeTool)

TDF_Label	transferModel (Handle(TDocStd_Document)&source, Handle(TDocStd_Document) &dest, VECTOR3D aScale)

bool	CompressSTEP (wxString &inputFile, wxString &outputFile)

	Handle (XCAFApp_Application) m_app

	Handle (TDocStd_Document) m_doc

	Handle (XCAFDoc_ShapeTool) m_assy

Private Attributes
TDF_Label	m_assy_label

bool	m_hasPCB

bool	m_simplifyShapes

bool	m_fuseShapes

std::vector< TDF_Label >	m_pcb_labels

MODEL_MAP	m_models

int	m_components

double	m_precision

double	m_angleprec

double	m_copperColor [3]

double	m_padColor [3]

BOARD_STACKUP	m_stackup

LSET	m_enabledLayers

wxString	m_netFilter

double	m_minx

double	m_mergeOCCMaxDist

std::vector< TopoDS_Shape >	m_copperCutouts

std::vector< TopoDS_Shape >	m_boardCutouts

std::vector< TopoDS_Shape >	m_board_outlines

std::map< wxString, std::vector< TopoDS_Shape > >	m_board_copper

std::map< wxString, std::vector< TopoDS_Shape > >	m_board_copper_pads

std::map< wxString, std::vector< TopoDS_Shape > >	m_board_copper_vias

std::map< wxString, std::vector< TopoDS_Shape > >	m_board_copper_fused

std::vector< TopoDS_Shape >	m_board_silkscreen

std::vector< TopoDS_Shape >	m_board_soldermask

std::map< wxString, std::vector< std::pair< gp_Pnt, TopoDS_Shape > > >	m_pad_points

wxString	m_pcbName
	Name of the PCB, which will most likely be the file name of the path.

OUTPUT_FORMAT	m_outFmt
	The current output format for created file.

REPORTER *	m_reporter

Detailed Description

Definition at line 90 of file step_pcb_model.h.

Constructor & Destructor Documentation

◆ STEP_PCB_MODEL()

STEP_PCB_MODEL::STEP_PCB_MODEL	(	const wxString &	aPcbName,
		REPORTER *	aReporter
	)

Definition at line 773 of file step_pcb_model.cpp.

References m_angleprec, m_assy_label, m_components, m_fuseShapes, m_hasPCB, m_mergeOCCMaxDist, m_minx, m_outFmt, m_pcbName, m_precision, m_simplifyShapes, OCC_MAX_DISTANCE_TO_MERGE_POINTS, USER_ANGLE_PREC, and USER_PREC.

◆ ~STEP_PCB_MODEL()

STEP_PCB_MODEL::~STEP_PCB_MODEL ( )

virtual

Definition at line 793 of file step_pcb_model.cpp.

Member Function Documentation

◆ AddBarrel()

bool STEP_PCB_MODEL::AddBarrel	(	const SHAPE_SEGMENT &	aShape,
		PCB_LAYER_ID	aLayerTop,
		PCB_LAYER_ID	aLayerBot,
		bool	aVia,
		const VECTOR2D &	aOrigin,
		const wxString &	aNetname
	)

Definition at line 1029 of file step_pcb_model.cpp.

References SEG::A, SEG::B, getLayerZPlacement(), SHAPE_SEGMENT::GetSeg(), SHAPE_SEGMENT::GetWidth(), m_board_copper_pads, m_board_copper_vias, and MakeShapeAsThickSegment().

◆ AddComponent()

bool STEP_PCB_MODEL::AddComponent	(	const std::string &	aFileName,
		const std::string &	aRefDes,
		bool	aBottom,
		VECTOR2D	aPosition,
		double	aRotation,
		VECTOR3D	aOffset,
		VECTOR3D	aOrientation,
		VECTOR3D	aScale,
		bool	aSubstituteModels = `true`
	)

Definition at line 1205 of file step_pcb_model.cpp.

References _, getModelLabel(), getModelLocation(), m_assy_label, m_reporter, REPORTER::Report(), RPT_SEVERITY_DEBUG, RPT_SEVERITY_ERROR, and RPT_SEVERITY_WARNING.

◆ AddHole()

bool STEP_PCB_MODEL::AddHole	(	const SHAPE_SEGMENT &	aShape,
		int	aPlatingThickness,
		PCB_LAYER_ID	aLayerTop,
		PCB_LAYER_ID	aLayerBot,
		bool	aVia,
		const VECTOR2D &	aOrigin,
		bool	aCutCopper,
		bool	aCutBody
	)

Definition at line 973 of file step_pcb_model.cpp.

References SEG::A, SEG::B, getLayerZPlacement(), SHAPE_SEGMENT::GetSeg(), SHAPE_SEGMENT::GetWidth(), m_boardCutouts, m_copperCutouts, and MakeShapeAsThickSegment().

◆ AddPadShape()

bool STEP_PCB_MODEL::AddPadShape	(	const PAD *	aPad,
		const VECTOR2D &	aOrigin,
		bool	aVia,
		SHAPE_POLY_SET *	aClipPolygon = `nullptr`
	)

Definition at line 800 of file step_pcb_model.cpp.

References _, B_Cu, B_Mask, SHAPE_POLY_SET::BooleanIntersection(), SHAPE_POLY_SET::ClearArcs(), LSET::Contains(), ERROR_INSIDE, ERROR_OUTSIDE, F_Cu, F_Mask, PAD::FlashLayer(), fuseShapesOrCompound(), PAD::GetAttribute(), PAD::GetDrillSize(), PAD::GetEffectiveHoleShape(), PAD::GetLayerSet(), getLayerZPlacement(), BOARD_ITEM::GetMaxError(), BOARD_CONNECTED_ITEM::GetNetname(), PAD::GetNumber(), BOARD_ITEM::GetParentFootprint(), PAD::GetProperty(), FOOTPRINT::GetReferenceAsString(), BOARD_CONNECTED_ITEM::GetShortNetname(), BOARD_ITEM::GetX(), BOARD_ITEM::GetY(), PAD::IsOnLayer(), EDA_IU_SCALE::IUTomm(), m_board_copper_pads, m_enabledLayers, m_fuseShapes, m_pad_points, m_reporter, m_simplifyShapes, MakePolygonAsWall(), MakeShapeAsThickSegment(), MakeShapes(), name, pcbIUScale, REPORTER::Report(), RPT_SEVERITY_ERROR, LSET::Seq(), TransformCircleToPolygon(), TransformOvalToPolygon(), PAD::TransformShapeToPolygon(), VECTOR2< T >::x, and VECTOR2< T >::y.

◆ AddPolygonShapes()

bool STEP_PCB_MODEL::AddPolygonShapes	(	const SHAPE_POLY_SET *	aPolyShapes,
		PCB_LAYER_ID	aLayer,
		const VECTOR2D &	aOrigin,
		const wxString &	aNetname
	)

Definition at line 1172 of file step_pcb_model.cpp.

References _, B_SilkS, LSET::Contains(), F_SilkS, SHAPE_POLY_SET::FullPointCount(), getLayerZPlacement(), IsCopperLayer(), SHAPE_POLY_SET::IsEmpty(), LayerName(), m_board_copper, m_board_silkscreen, m_board_soldermask, m_enabledLayers, m_reporter, m_simplifyShapes, MakeShapes(), REPORTER::Report(), and RPT_SEVERITY_ERROR.

◆ CompressSTEP()

bool STEP_PCB_MODEL::CompressSTEP	(	wxString &	inputFile,
		wxString &	outputFile
	)

private

Definition at line 2364 of file step_pcb_model.cpp.

References _, m_reporter, and REPORTER::Report().

Referenced by WriteSTEP().

◆ CreatePCB()

bool STEP_PCB_MODEL::CreatePCB	(	SHAPE_POLY_SET &	aOutline,
		VECTOR2D	aOrigin,
		bool	aPushBoardBody
	)

Definition at line 1896 of file step_pcb_model.cpp.

References _, KIGFX::COLOR4D::a, SHAPE_POLY_SET::Append(), KIGFX::COLOR4D::b, B_Mask, B_SilkS, BS_ITEM_TYPE_DIELECTRIC, colorFromStackup(), LSET::Contains(), SHAPE_POLY_SET::CPolygons(), cut, KIGFX::COLOR4D::Darken(), F_Mask, F_SilkS, SHAPE_POLY_SET::FullPointCount(), fuseShapesOrCompound(), KIGFX::COLOR4D::g, getBoardBodyZPlacement(), GetKiCadThreadPool(), BOARD_STACKUP::GetList(), Handle(), isBoardOutlineValid(), KEY_CORE, m_assy_label, m_board_copper, m_board_copper_fused, m_board_copper_pads, m_board_copper_vias, m_board_outlines, m_board_silkscreen, m_board_soldermask, m_boardCutouts, m_copperColor, m_copperCutouts, m_enabledLayers, m_fuseShapes, m_hasPCB, m_padColor, m_pcb_labels, m_pcbName, m_reporter, m_stackup, makeCompound(), MakeShapes(), SHAPE_POLY_SET::OutlineCount(), KIGFX::COLOR4D::r, REPORTER::Report(), RPT_SEVERITY_DEBUG, RPT_SEVERITY_ERROR, RPT_SEVERITY_WARNING, tp, and UnescapeString().

◆ getBoardBodyZPlacement()

void STEP_PCB_MODEL::getBoardBodyZPlacement	(	double &	aZPos,
		double &	aThickness
	)

private

Definition at line 1156 of file step_pcb_model.cpp.

References B_Cu, F_Cu, and getLayerZPlacement().

Referenced by CreatePCB(), and getModelLocation().

◆ getCopperLayerZPlacement()

void STEP_PCB_MODEL::getCopperLayerZPlacement	(	const PCB_LAYER_ID	aLayer,
		double &	aZPos,
		double &	aThickness
	)

private

Definition at line 1097 of file step_pcb_model.cpp.

References B_Cu, BS_ITEM_TYPE_COPPER, BS_ITEM_TYPE_DIELECTRIC, F_Cu, BOARD_STACKUP_ITEM::GetBrdLayerId(), BOARD_STACKUP::GetList(), BOARD_STACKUP_ITEM::GetSublayersCount(), BOARD_STACKUP_ITEM::GetThickness(), BOARD_STACKUP_ITEM::GetType(), BOARD_STACKUP_ITEM::GetTypeName(), EDA_IU_SCALE::IUTomm(), KEY_PREPREG, m_stackup, and pcbIUScale.

Referenced by getLayerZPlacement().

◆ getLayerZPlacement()

void STEP_PCB_MODEL::getLayerZPlacement	(	const PCB_LAYER_ID	aLayer,
		double &	aZPos,
		double &	aThickness
	)

private

Definition at line 1057 of file step_pcb_model.cpp.

References B_Cu, B_SilkS, F_Cu, F_SilkS, getCopperLayerZPlacement(), IsBackLayer(), IsCopperLayer(), and IsFrontLayer().

Referenced by AddBarrel(), AddHole(), AddPadShape(), AddPolygonShapes(), getBoardBodyZPlacement(), and getModelLocation().

◆ getModelLabel()

bool STEP_PCB_MODEL::getModelLabel	(	const std::string &	aFileNameUTF8,
		VECTOR3D	aScale,
		TDF_Label &	aLabel,
		bool	aSubstituteModels,
		wxString *	aErrorMessage = `nullptr`
	)

private

Load a 3D model data.

Parameters

aFileNameUTF8	is the filename encoded UTF8 (different formats allowed) but for WRML files a model data can be loaded instead of the vrml data, not suitable in a step file.
aScale	is the X,Y,Z scaling factors.
aLabel	is the TDF_Label to store the data.
aSubstituteModels	= true to allows data substitution, false to disallow.
aErrorMessage	(can be nullptr) is an error message to be displayed on error.

Returns: true if successfully loaded, false on error.

Definition at line 2720 of file step_pcb_model.cpp.

References _, fileType(), FMT_IGES, FMT_STEP, FMT_STEPZ, FMT_WRL, FMT_WRZ, getModelLabel(), Handle(), m_components, m_models, m_outFmt, m_reporter, prefixNames(), readIGES(), readSTEP(), readVRML(), REPORTER::Report(), RPT_SEVERITY_ERROR, TO_UTF8, transferModel(), VECTOR3< T >::x, VECTOR3< T >::y, and VECTOR3< T >::z.

Referenced by AddComponent(), and getModelLabel().

◆ getModelLocation()

bool STEP_PCB_MODEL::getModelLocation	(	bool	aBottom,
		VECTOR2D	aPosition,
		double	aRotation,
		VECTOR3D	aOffset,
		VECTOR3D	aOrientation,
		TopLoc_Location &	aLocation
	)

private

Definition at line 2968 of file step_pcb_model.cpp.

References B_Cu, BOARD_OFFSET, F_Cu, getBoardBodyZPlacement(), getLayerZPlacement(), VECTOR2< T >::x, VECTOR3< T >::x, VECTOR2< T >::y, VECTOR3< T >::y, and VECTOR3< T >::z.

Referenced by AddComponent().

◆ Handle() [1/3]

STEP_PCB_MODEL::Handle ( TDocStd_Document )

private

◆ Handle() [2/3]

STEP_PCB_MODEL::Handle ( XCAFApp_Application )

private

Referenced by CreatePCB(), getModelLabel(), MakeShapeAsThickSegment(), transferModel(), WriteBREP(), and WriteXAO().

◆ Handle() [3/3]

STEP_PCB_MODEL::Handle ( XCAFDoc_ShapeTool )

private

◆ isBoardOutlineValid()

bool STEP_PCB_MODEL::isBoardOutlineValid ( )

private

Returns: true if the board(s) outline is valid. False otherwise

Definition at line 1313 of file step_pcb_model.cpp.

References m_pcb_labels.

Referenced by CreatePCB(), WriteBREP(), WriteGLTF(), WritePLY(), WriteSTEP(), and WriteSTL().

◆ MakePolygonAsWall()

bool STEP_PCB_MODEL::MakePolygonAsWall	(	TopoDS_Shape &	aShape,
		SHAPE_POLY_SET &	aPolySet,
		double	aHeight,
		double	aZposition,
		const VECTOR2D &	aOrigin
	)

Make a polygonal shape to create a vertical wall.

It is a specialized version of MakeShape()

Parameters

aShape	is the TopoDS_Shape to initialize (must be empty)
aPolySet	is the outline of the wall
aHeight	is the height of the wall.
aZposition	is the Z postion of the wall
aOrigin	is the origin of the coordinates

Returns: true if success

Definition at line 1458 of file step_pcb_model.cpp.

References m_simplifyShapes, and MakeShapes().

Referenced by AddPadShape().

◆ MakeShapeAsThickSegment()

bool STEP_PCB_MODEL::MakeShapeAsThickSegment	(	TopoDS_Shape &	aShape,
		VECTOR2D	aStartPoint,
		VECTOR2D	aEndPoint,
		double	aWidth,
		double	aThickness,
		double	aZposition,
		const VECTOR2D &	aOrigin
	)

Make a segment shape based on start and end point.

If they're too close, make a cylinder. It is a specialized version of MakeShape()

Parameters

aShape	is the TopoDS_Shape to initialize (must be empty)
aStartPoint	is the start point of the segment
aEndPoint	is the end point of the segment
aWidth	is the width of the segment
aThickness	is the height of the created segment, or 0.0: flat face pointing up, -0.0: down.
aOrigin	is the origin of the coordinates

Returns: true if success

Definition at line 1319 of file step_pcb_model.cpp.

References _, circle(), Handle(), EDA_IU_SCALE::IUTomm(), m_mergeOCCMaxDist, m_reporter, pcbIUScale, REPORTER::Report(), RotatePoint(), RPT_SEVERITY_ERROR, VECTOR2< T >::x, and VECTOR2< T >::y.

Referenced by AddBarrel(), AddHole(), and AddPadShape().

◆ MakeShapes()

bool STEP_PCB_MODEL::MakeShapes	(	std::vector< TopoDS_Shape > &	aShapes,
		const SHAPE_POLY_SET &	aPolySet,
		bool	aConvertToArcs,
		double	aThickness,
		double	aZposition,
		const VECTOR2D &	aOrigin
	)

Convert a SHAPE_POLY_SET to TopoDS_Shape's (polygonal vertical prisms, or flat faces)

Parameters

aShapes	is the TopoDS_Shape list to append to
aPolySet	is the polygon set
aConvertToArcs	set to approximate with arcs
aThickness	is the height of the created prism, or 0.0: flat face pointing up, -0.0: down.
aOrigin	is the origin of the coordinates

Returns: true if success

Definition at line 1660 of file step_pcb_model.cpp.

References _, approximateLineChainWithArcs(), SHAPE_POLY_SET::CPolygon(), SHAPE_POLY_SET::CPolygons(), formatBBox(), EDA_IU_SCALE::IUTomm(), m_mergeOCCMaxDist, m_reporter, makeWireFromChain(), pcbIUScale, SHAPE_POLY_SET::Polygon(), REPORTER::Report(), RPT_SEVERITY_DEBUG, RPT_SEVERITY_ERROR, SHAPE_POLY_SET::Simplify(), VECTOR2< T >::x, and VECTOR2< T >::y.

Referenced by AddPadShape(), AddPolygonShapes(), CreatePCB(), and MakePolygonAsWall().

◆ OCCSetMergeMaxDistance()

void STEP_PCB_MODEL::OCCSetMergeMaxDistance ( double aDistance = OCC_MAX_DISTANCE_TO_MERGE_POINTS )

Definition at line 1306 of file step_pcb_model.cpp.

References m_mergeOCCMaxDist.

◆ performMeshing()

bool STEP_PCB_MODEL::performMeshing ( Handle(XCAFDoc_ShapeTool) & aShapeTool )

private

Definition at line 3185 of file step_pcb_model.cpp.

References DEG2RAD(), m_reporter, REPORTER::Report(), and RPT_SEVERITY_DEBUG.

Referenced by WriteGLTF(), WritePLY(), and WriteSTL().

◆ readIGES()

bool STEP_PCB_MODEL::readIGES	(	Handle(TDocStd_Document) &	aDoc,
		const char *	aFname
	)

private

Definition at line 3038 of file step_pcb_model.cpp.

References USER_PREC.

Referenced by getModelLabel().

◆ readSTEP()

bool STEP_PCB_MODEL::readSTEP	(	Handle(TDocStd_Document) &	aDoc,
		const char *	aFname
	)

private

Definition at line 3081 of file step_pcb_model.cpp.

References USER_PREC.

Referenced by getModelLabel().

◆ readVRML()

bool STEP_PCB_MODEL::readVRML	(	Handle(TDocStd_Document) &	aDoc,
		const char *	aFname
	)

private

Definition at line 3123 of file step_pcb_model.cpp.

Referenced by getModelLabel().

◆ SetCopperColor()

void STEP_PCB_MODEL::SetCopperColor	(	double	r,
		double	g,
		double	b
	)

Definition at line 1290 of file step_pcb_model.cpp.

References m_copperColor.

◆ SetEnabledLayers()

void STEP_PCB_MODEL::SetEnabledLayers ( const LSET & aLayers )

Definition at line 1260 of file step_pcb_model.cpp.

References m_enabledLayers.

◆ SetFuseShapes()

void STEP_PCB_MODEL::SetFuseShapes ( bool aValue )

Definition at line 1266 of file step_pcb_model.cpp.

References m_fuseShapes.

◆ SetNetFilter()

void STEP_PCB_MODEL::SetNetFilter ( const wxString & aFilter )

Definition at line 1284 of file step_pcb_model.cpp.

References m_netFilter.

◆ SetPadColor()

void STEP_PCB_MODEL::SetPadColor	(	double	r,
		double	g,
		double	b
	)

Definition at line 1298 of file step_pcb_model.cpp.

References m_padColor.

◆ SetSimplifyShapes()

void STEP_PCB_MODEL::SetSimplifyShapes ( bool aValue )

Definition at line 1272 of file step_pcb_model.cpp.

References m_simplifyShapes.

◆ SetStackup()

void STEP_PCB_MODEL::SetStackup ( const BOARD_STACKUP & aStackup )

Definition at line 1278 of file step_pcb_model.cpp.

References m_stackup.

◆ SpecializeVariant()

void STEP_PCB_MODEL::SpecializeVariant ( OUTPUT_FORMAT aVariant )

inline

Definition at line 97 of file step_pcb_model.h.

References m_outFmt.

◆ transferModel()

TDF_Label STEP_PCB_MODEL::transferModel	(	Handle(TDocStd_Document)&	source,
		Handle(TDocStd_Document) &	dest,
		VECTOR3D	aScale
	)

private

Definition at line 3142 of file step_pcb_model.cpp.

References Handle(), rescaleShapes(), VECTOR3< T >::x, VECTOR3< T >::y, and VECTOR3< T >::z.

Referenced by getModelLabel().

◆ WriteBREP()

bool STEP_PCB_MODEL::WriteBREP ( const wxString & aFileName )

Definition at line 2502 of file step_pcb_model.cpp.

References _, getOneShape(), Handle(), isBoardOutlineValid(), m_outFmt, m_reporter, REPORTER::Report(), and RPT_SEVERITY_ERROR.

◆ WriteGLTF()

bool STEP_PCB_MODEL::WriteGLTF ( const wxString & aFileName )

Write the assembly in binary GLTF Format.

We only support binary GLTF because GLTF is weird Officially, binary GLTF is actually json+binary in one file If we elected non-binary output with opecascade, it will generate that one file as two separate files, one containing json that references the binary Which is actually more annoying to deal with (to do the temp file rename, since we dont control the binary name) and silly when you can just have the one file.

Parameters

aFileName Output file path

Returns: true if the write succeeded without error

Definition at line 3213 of file step_pcb_model.cpp.

References _, KIPLATFORM::IO::DuplicatePermissions(), GetISO8601CurrentDateTime(), GetSemanticVersion(), isBoardOutlineValid(), m_outFmt, m_reporter, performMeshing(), REPORTER::Report(), and RPT_SEVERITY_ERROR.

◆ WritePLY()

bool STEP_PCB_MODEL::WritePLY ( const wxString & aFileName )

Definition at line 3282 of file step_pcb_model.cpp.

References _, KIPLATFORM::IO::DuplicatePermissions(), GetISO8601CurrentDateTime(), GetSemanticVersion(), isBoardOutlineValid(), m_outFmt, m_reporter, performMeshing(), REPORTER::Report(), and RPT_SEVERITY_ERROR.

◆ WriteSTEP()

bool STEP_PCB_MODEL::WriteSTEP	(	const wxString &	aFileName,
		bool	aOptimize,
		bool	compress
	)

Definition at line 2403 of file step_pcb_model.cpp.

References _, CompressSTEP(), KIPLATFORM::IO::DuplicatePermissions(), isBoardOutlineValid(), m_outFmt, m_reporter, REPORTER::Report(), RPT_SEVERITY_ERROR, and RPT_SEVERITY_WARNING.

◆ WriteSTL()

bool STEP_PCB_MODEL::WriteSTL ( const wxString & aFileName )

Definition at line 3355 of file step_pcb_model.cpp.

References _, KIPLATFORM::IO::DuplicatePermissions(), getOneShape(), isBoardOutlineValid(), m_outFmt, m_reporter, performMeshing(), REPORTER::Report(), and RPT_SEVERITY_ERROR.

◆ WriteXAO()

bool STEP_PCB_MODEL::WriteXAO ( const wxString & aFileName )

Definition at line 2535 of file step_pcb_model.cpp.

References getOneShape(), Handle(), m_outFmt, m_pad_points, m_reporter, name, REPORTER::Report(), RPT_SEVERITY_DEBUG, and RPT_SEVERITY_ERROR.

Member Data Documentation

◆ m_angleprec

double STEP_PCB_MODEL::m_angleprec

private

Definition at line 271 of file step_pcb_model.h.

Referenced by STEP_PCB_MODEL().

◆ m_assy_label

TDF_Label STEP_PCB_MODEL::m_assy_label

private

Definition at line 263 of file step_pcb_model.h.

Referenced by AddComponent(), CreatePCB(), and STEP_PCB_MODEL().

◆ m_board_copper

std::map<wxString, std::vector<TopoDS_Shape> > STEP_PCB_MODEL::m_board_copper

private

Definition at line 290 of file step_pcb_model.h.

Referenced by AddPolygonShapes(), and CreatePCB().

◆ m_board_copper_fused

std::map<wxString, std::vector<TopoDS_Shape> > STEP_PCB_MODEL::m_board_copper_fused

private

Definition at line 293 of file step_pcb_model.h.

Referenced by CreatePCB().

◆ m_board_copper_pads

std::map<wxString, std::vector<TopoDS_Shape> > STEP_PCB_MODEL::m_board_copper_pads

private

Definition at line 291 of file step_pcb_model.h.

Referenced by AddBarrel(), AddPadShape(), and CreatePCB().

◆ m_board_copper_vias

std::map<wxString, std::vector<TopoDS_Shape> > STEP_PCB_MODEL::m_board_copper_vias

private

Definition at line 292 of file step_pcb_model.h.

Referenced by AddBarrel(), and CreatePCB().

◆ m_board_outlines

std::vector<TopoDS_Shape> STEP_PCB_MODEL::m_board_outlines

private

Definition at line 287 of file step_pcb_model.h.

Referenced by CreatePCB().

◆ m_board_silkscreen

std::vector<TopoDS_Shape> STEP_PCB_MODEL::m_board_silkscreen

private

Definition at line 296 of file step_pcb_model.h.

Referenced by AddPolygonShapes(), and CreatePCB().

◆ m_board_soldermask

std::vector<TopoDS_Shape> STEP_PCB_MODEL::m_board_soldermask

private

Definition at line 297 of file step_pcb_model.h.

Referenced by AddPolygonShapes(), and CreatePCB().

◆ m_boardCutouts

std::vector<TopoDS_Shape> STEP_PCB_MODEL::m_boardCutouts

private

Definition at line 284 of file step_pcb_model.h.

Referenced by AddHole(), and CreatePCB().

◆ m_components

int STEP_PCB_MODEL::m_components

private

Definition at line 269 of file step_pcb_model.h.

Referenced by getModelLabel(), and STEP_PCB_MODEL().

◆ m_copperColor

double STEP_PCB_MODEL::m_copperColor[3]

private

Definition at line 272 of file step_pcb_model.h.

Referenced by CreatePCB(), and SetCopperColor().

◆ m_copperCutouts

std::vector<TopoDS_Shape> STEP_PCB_MODEL::m_copperCutouts

private

Definition at line 283 of file step_pcb_model.h.

Referenced by AddHole(), and CreatePCB().

◆ m_enabledLayers

LSET STEP_PCB_MODEL::m_enabledLayers

private

Definition at line 275 of file step_pcb_model.h.

Referenced by AddPadShape(), AddPolygonShapes(), CreatePCB(), and SetEnabledLayers().

◆ m_fuseShapes

bool STEP_PCB_MODEL::m_fuseShapes

private

Definition at line 266 of file step_pcb_model.h.

Referenced by AddPadShape(), CreatePCB(), SetFuseShapes(), and STEP_PCB_MODEL().

◆ m_hasPCB

bool STEP_PCB_MODEL::m_hasPCB

private

Definition at line 264 of file step_pcb_model.h.

Referenced by CreatePCB(), and STEP_PCB_MODEL().

◆ m_mergeOCCMaxDist

double STEP_PCB_MODEL::m_mergeOCCMaxDist

private

Definition at line 279 of file step_pcb_model.h.

Referenced by MakeShapeAsThickSegment(), MakeShapes(), OCCSetMergeMaxDistance(), and STEP_PCB_MODEL().

◆ m_minx

double STEP_PCB_MODEL::m_minx

private

Definition at line 278 of file step_pcb_model.h.

Referenced by STEP_PCB_MODEL().

◆ m_models

MODEL_MAP STEP_PCB_MODEL::m_models

private

Definition at line 268 of file step_pcb_model.h.

Referenced by getModelLabel().

◆ m_netFilter

wxString STEP_PCB_MODEL::m_netFilter

private

Definition at line 276 of file step_pcb_model.h.

Referenced by SetNetFilter().

◆ m_outFmt

OUTPUT_FORMAT STEP_PCB_MODEL::m_outFmt

private

The current output format for created file.

Definition at line 306 of file step_pcb_model.h.

Referenced by getModelLabel(), SpecializeVariant(), STEP_PCB_MODEL(), WriteBREP(), WriteGLTF(), WritePLY(), WriteSTEP(), WriteSTL(), and WriteXAO().

◆ m_pad_points

std::map<wxString, std::vector<std::pair<gp_Pnt, TopoDS_Shape> > > STEP_PCB_MODEL::m_pad_points

private

Definition at line 300 of file step_pcb_model.h.

Referenced by AddPadShape(), and WriteXAO().

◆ m_padColor

double STEP_PCB_MODEL::m_padColor[3]

private

Definition at line 273 of file step_pcb_model.h.

Referenced by CreatePCB(), and SetPadColor().

◆ m_pcb_labels

std::vector<TDF_Label> STEP_PCB_MODEL::m_pcb_labels

private

Definition at line 267 of file step_pcb_model.h.

Referenced by CreatePCB(), and isBoardOutlineValid().

◆ m_pcbName

wxString STEP_PCB_MODEL::m_pcbName

private

Name of the PCB, which will most likely be the file name of the path.

Definition at line 303 of file step_pcb_model.h.

Referenced by CreatePCB(), and STEP_PCB_MODEL().

◆ m_precision

double STEP_PCB_MODEL::m_precision

private

Definition at line 270 of file step_pcb_model.h.

Referenced by STEP_PCB_MODEL().

◆ m_reporter

REPORTER* STEP_PCB_MODEL::m_reporter

private

Definition at line 307 of file step_pcb_model.h.

Referenced by AddComponent(), AddPadShape(), AddPolygonShapes(), CompressSTEP(), CreatePCB(), getModelLabel(), MakeShapeAsThickSegment(), MakeShapes(), performMeshing(), WriteBREP(), WriteGLTF(), WritePLY(), WriteSTEP(), WriteSTL(), and WriteXAO().

◆ m_simplifyShapes

bool STEP_PCB_MODEL::m_simplifyShapes

private

Definition at line 265 of file step_pcb_model.h.

Referenced by AddPadShape(), AddPolygonShapes(), MakePolygonAsWall(), SetSimplifyShapes(), and STEP_PCB_MODEL().

◆ m_stackup

BOARD_STACKUP STEP_PCB_MODEL::m_stackup

private

Definition at line 274 of file step_pcb_model.h.

Referenced by CreatePCB(), getCopperLayerZPlacement(), and SetStackup().

The documentation for this class was generated from the following files:

Public Member Functions

Private Member Functions

Private Attributes

Detailed Description

Constructor & Destructor Documentation

◆ STEP_PCB_MODEL()

◆ ~STEP_PCB_MODEL()

Member Function Documentation

◆ AddBarrel()

◆ AddComponent()

◆ AddHole()

◆ AddPadShape()

◆ AddPolygonShapes()

◆ CompressSTEP()

◆ CreatePCB()

◆ getBoardBodyZPlacement()

◆ getCopperLayerZPlacement()

◆ getLayerZPlacement()

◆ getModelLabel()

◆ getModelLocation()

◆ Handle() [1/3]

◆ Handle() [2/3]

◆ Handle() [3/3]

◆ isBoardOutlineValid()

◆ MakePolygonAsWall()

◆ MakeShapeAsThickSegment()

◆ MakeShapes()

◆ OCCSetMergeMaxDistance()

◆ performMeshing()

◆ readIGES()

◆ readSTEP()

◆ readVRML()

◆ SetCopperColor()

◆ SetEnabledLayers()

◆ SetFuseShapes()

◆ SetNetFilter()

◆ SetPadColor()

◆ SetSimplifyShapes()

◆ SetStackup()

◆ SpecializeVariant()

◆ transferModel()

◆ WriteBREP()

◆ WriteGLTF()

◆ WritePLY()

◆ WriteSTEP()

◆ WriteSTL()

◆ WriteXAO()

Member Data Documentation

◆ m_angleprec

◆ m_assy_label

◆ m_board_copper

◆ m_board_copper_fused

◆ m_board_copper_pads

◆ m_board_copper_vias

◆ m_board_outlines

◆ m_board_silkscreen

◆ m_board_soldermask

◆ m_boardCutouts

◆ m_components

◆ m_copperColor

◆ m_copperCutouts

◆ m_enabledLayers

◆ m_fuseShapes

◆ m_hasPCB

◆ m_mergeOCCMaxDist

◆ m_minx

◆ m_models

◆ m_netFilter

◆ m_outFmt

◆ m_pad_points

◆ m_padColor

◆ m_pcb_labels

◆ m_pcbName

◆ m_precision

◆ m_reporter

◆ m_simplifyShapes

◆ m_stackup