Manage layers needed to make a physical board. More...

#include <board_stackup.h>

Public Member Functions
	BOARD_STACKUP ()

	BOARD_STACKUP (const BOARD_STACKUP &aOther)

BOARD_STACKUP &	operator= (const BOARD_STACKUP &aOther)

	~BOARD_STACKUP ()

const std::vector< BOARD_STACKUP_ITEM * > &	GetList () const

BOARD_STACKUP_ITEM *	GetStackupLayer (int aIndex)

void	RemoveAll ()
	Delete all items in list and clear the list. More...

int	GetCount () const

int	BuildBoardThicknessFromStackup () const

void	Add (BOARD_STACKUP_ITEM *aItem)
	Add a new item in stackup layer. More...

bool	SynchronizeWithBoard (BOARD_DESIGN_SETTINGS *aSettings)
	Synchronize the BOARD_STACKUP_ITEM* list with the board. More...

void	BuildDefaultStackupList (const BOARD_DESIGN_SETTINGS *aSettings, int aActiveCopperLayersCount=0)
	Create a default stackup, according to the current BOARD_DESIGN_SETTINGS settings. More...

void	FormatBoardStackup (OUTPUTFORMATTER aFormatter, const BOARD aBoard, int aNestLevel) const
	Write the stackup info on board file. More...

int	GetLayerDistance (PCB_LAYER_ID aFirstLayer, PCB_LAYER_ID aSecondLayer) const
	Calculate the distance (height) between the two given copper layers. More...

Static Public Member Functions
static LSET	StackupAllowedBrdLayers ()

Public Attributes
wxString	m_FinishType
	The name of external copper finish. More...

bool	m_HasDielectricConstrains
	True if some layers have impedance controlled tracks or have specific constrains for micro-wave applications If the board has dielectric constrains, the .gbrjob will contain info about dielectric constrains: loss tangent and Epsilon rel. More...

bool	m_HasThicknessConstrains
	True if some layers (copper and/or dielectric) have specific thickness. More...

BS_EDGE_CONNECTOR_CONSTRAINTS	m_EdgeConnectorConstraints
	If the board has edge connector cards, some constrains can be specified in job file: BS_EDGE_CONNECTOR_NONE = no edge connector BS_EDGE_CONNECTOR_IN_USE = board has edge connectors BS_EDGE_CONNECTOR_BEVELLED = edge connectors are beveled. More...

bool	m_CastellatedPads
	True if castellated pads exist. More...

bool	m_EdgePlating
	True if the edge board is plated. More...

Private Attributes
std::vector< BOARD_STACKUP_ITEM * >	m_list

Detailed Description

Manage layers needed to make a physical board.

They are solder mask, silk screen, copper and dielectric. Some other layers, used in fabrication, are not managed here because they are not used to make a physical board itself.

Note: There are a few other parameters related to the physical stackup like finish type, impedance control and a few others.

Definition at line 210 of file board_stackup.h.

Constructor & Destructor Documentation

◆ BOARD_STACKUP() [1/2]

BOARD_STACKUP::BOARD_STACKUP ( )

Definition at line 309 of file board_stackup.cpp.

References BS_EDGE_CONNECTOR_NONE, m_CastellatedPads, m_EdgeConnectorConstraints, m_EdgePlating, m_FinishType, m_HasDielectricConstrains, and m_HasThicknessConstrains.

◆ BOARD_STACKUP() [2/2]

BOARD_STACKUP::BOARD_STACKUP ( const BOARD_STACKUP & aOther )

Definition at line 321 of file board_stackup.cpp.

References Add(), m_CastellatedPads, m_EdgeConnectorConstraints, m_EdgePlating, m_FinishType, m_HasDielectricConstrains, m_HasThicknessConstrains, and m_list.

◆ ~BOARD_STACKUP()

BOARD_STACKUP::~BOARD_STACKUP ( )

inline

Definition at line 217 of file board_stackup.h.

References RemoveAll().

Member Function Documentation

◆ Add()

void BOARD_STACKUP::Add ( BOARD_STACKUP_ITEM * aItem )

inline

Add a new item in stackup layer.

Definition at line 245 of file board_stackup.h.

References m_list.

Referenced by BOARD_STACKUP(), BuildDefaultStackupList(), operator=(), PCB_PARSER::parseBoardStackup(), and PANEL_SETUP_BOARD_STACKUP::TransferDataFromWindow().

◆ BuildBoardThicknessFromStackup()

int BOARD_STACKUP::BuildBoardThicknessFromStackup ( ) const

Returns: the board thickness ( in UI) from the thickness of BOARD_STACKUP_ITEM list

Definition at line 381 of file board_stackup.cpp.

References m_list.

Referenced by CADSTAR_PCB_ARCHIVE_LOADER::loadBoardStackup(), and PANEL_SETUP_BOARD_STACKUP::TransferDataFromWindow().

◆ BuildDefaultStackupList()

void BOARD_STACKUP::BuildDefaultStackupList	(	const BOARD_DESIGN_SETTINGS *	aSettings,
		int	aActiveCopperLayersCount = `0`
	)

Create a default stackup, according to the current BOARD_DESIGN_SETTINGS settings.

Parameters

aSettings	is the current board setting. if nullptr, build a full stackup (with 32 copper layers)
aActiveCopperLayersCount	is used only if aSettings == nullptr is the number of copper layers to use to calculate a default dielectric thickness. ((<= 0 to use all copper layers)

Definition at line 499 of file board_stackup.cpp.

References _HKI, Add(), B_Cu, B_Mask, B_Paste, B_SilkS, BS_ITEM_TYPE_COPPER, BS_ITEM_TYPE_DIELECTRIC, BS_ITEM_TYPE_SILKSCREEN, BS_ITEM_TYPE_SOLDERMASK, BS_ITEM_TYPE_SOLDERPASTE, F_Mask, F_Paste, F_SilkS, BOARD_DESIGN_SETTINGS::GetBoardThickness(), BOARD_STACKUP_ITEM::GetCopperDefaultThickness(), BOARD_DESIGN_SETTINGS::GetCopperLayerCount(), BOARD_DESIGN_SETTINGS::GetEnabledLayers(), BOARD_STACKUP_ITEM::GetMaskDefaultThickness(), BOARD_DESIGN_SETTINGS::GetStackupDescriptor(), KEY_COPPER, KEY_CORE, KEY_PREPREG, m_CastellatedPads, m_EdgeConnectorConstraints, m_EdgePlating, m_FinishType, EDA_IU_SCALE::mmToIU(), pcbIUScale, BOARD_STACKUP_ITEM::SetBrdLayerId(), BOARD_STACKUP_ITEM::SetDielectricLayerId(), BOARD_STACKUP_ITEM::SetMaterial(), BOARD_STACKUP_ITEM::SetThickness(), BOARD_STACKUP_ITEM::SetTypeName(), and StackupAllowedBrdLayers().

Referenced by PANEL_SETUP_BOARD_STACKUP::buildLayerStackPanel(), CADSTAR_PCB_ARCHIVE_LOADER::loadBoardStackup(), PANEL_PREVIEW_3D_MODEL::PANEL_PREVIEW_3D_MODEL(), ALTIUM_PCB::ParseBoard6Data(), SynchronizeWithBoard(), and PANEL_PREVIEW_3D_MODEL::updateBoardThickness().

◆ FormatBoardStackup()

void BOARD_STACKUP::FormatBoardStackup	(	OUTPUTFORMATTER *	aFormatter,
		const BOARD *	aBoard,
		int	aNestLevel
	)		const

Write the stackup info on board file.

Parameters

aFormatter	is the OUTPUTFORMATTER used to create the file
aBoard	is the board
aNestLevel	is the index to nest level to indent the lines in file

Definition at line 626 of file board_stackup.cpp.

References BS_ITEM_TYPE_DIELECTRIC, FormatDouble2Str(), EDA_UNIT_UTILS::FormatInternalUnits(), IsPrmSpecified(), m_CastellatedPads, m_EdgeConnectorConstraints, m_EdgePlating, m_FinishType, m_HasDielectricConstrains, m_list, LSET::Name(), pcbIUScale, OUTPUTFORMATTER::Print(), OUTPUTFORMATTER::Quotew(), and UNDEFINED_LAYER.

Referenced by PCB_PLUGIN::formatSetup(), and PANEL_SETUP_BOARD_STACKUP::TransferDataFromWindow().

◆ GetCount()

int BOARD_STACKUP::GetCount ( ) const

inline

Returns: the number of layers in the stackup

Definition at line 239 of file board_stackup.h.

References m_list.

Referenced by GERBER_JOBFILE_WRITER::addJSONMaterialStackup(), EXPORTER_STEP::calculatePcbThickness(), DRAWING_TOOL::DrawSpecificationStackup(), GetStackupLayer(), and BOARD_ADAPTER::InitSettings().

◆ GetLayerDistance()

int BOARD_STACKUP::GetLayerDistance	(	PCB_LAYER_ID	aFirstLayer,
		PCB_LAYER_ID	aSecondLayer
	)		const

Calculate the distance (height) between the two given copper layers.

This factors in the thickness of any dielectric and copper layers between the two given layers, and half the height of the given start and end layers. This half-height calculation allows this to be used for consistent length measurements when calculating net length through a series of vias. A more advanced algorithm would be possible once we have a good concept of the start and end for a length measurement, but for now this will do. See https://gitlab.com/kicad/code/kicad/-/issues/8384 for more background.

Parameters

aFirstLayer	is a copper layer
aSecondLayer	is a different copper layer

Returns: the height (in IU) between the two layers

Definition at line 718 of file board_stackup.cpp.

References IsCopperLayer(), m_list, and UNDEFINED_LAYER.

Referenced by DIALOG_NET_INSPECTOR::calculateViaLength(), BOARD::GetTrackLength(), DRC_TEST_PROVIDER_MATCHED_LENGTH::runInternal(), and PNS_KICAD_IFACE_BASE::StackupHeight().

◆ GetList()

const std::vector< BOARD_STACKUP_ITEM * > & BOARD_STACKUP::GetList ( ) const

inline

Definition at line 219 of file board_stackup.h.

References m_list.

Referenced by PANEL_SETUP_BOARD_STACKUP::buildLayerStackPanel(), BuildStackupReport(), EXPORTER_STEP::calculatePcbThickness(), DRAWING_TOOL::DrawSpecificationStackup(), EXPORTER_PCB_VRML::EXPORTER_PCB_VRML(), GetStackupLayer(), BOARD_ADAPTER::InitSettings(), CADSTAR_PCB_ARCHIVE_LOADER::loadBoardStackup(), PANEL_SETUP_BOARD_STACKUP::onMaterialChange(), PANEL_SETUP_BOARD_STACKUP::onRemoveDielectricLayer(), PANEL_SETUP_BOARD_STACKUP::onRemoveDielUI(), ALTIUM_PCB::ParseBoard6Data(), SynchronizeWithBoard(), PANEL_SETUP_BOARD_STACKUP::TransferDataFromWindow(), and HYPERLYNX_EXPORTER::writeStackupInfo().

◆ GetStackupLayer()

BOARD_STACKUP_ITEM * BOARD_STACKUP::GetStackupLayer ( int aIndex )

Returns: a reference to the layer aIndex, or nullptr if not exists

Definition at line 372 of file board_stackup.cpp.

References GetCount(), and GetList().

Referenced by GERBER_JOBFILE_WRITER::addJSONMaterialStackup().

◆ operator=()

BOARD_STACKUP & BOARD_STACKUP::operator= ( const BOARD_STACKUP & aOther )

Definition at line 340 of file board_stackup.cpp.

References Add(), m_CastellatedPads, m_EdgeConnectorConstraints, m_EdgePlating, m_FinishType, m_HasDielectricConstrains, m_HasThicknessConstrains, m_list, and RemoveAll().

◆ RemoveAll()

void BOARD_STACKUP::RemoveAll ( )

Delete all items in list and clear the list.

Definition at line 363 of file board_stackup.cpp.

References m_list.

Referenced by CADSTAR_PCB_ARCHIVE_LOADER::loadBoardStackup(), operator=(), PANEL_PREVIEW_3D_MODEL::PANEL_PREVIEW_3D_MODEL(), ALTIUM_PCB::ParseBoard6Data(), PANEL_SETUP_BOARD_STACKUP::TransferDataFromWindow(), PANEL_PREVIEW_3D_MODEL::updateBoardThickness(), and ~BOARD_STACKUP().

◆ StackupAllowedBrdLayers()

static LSET BOARD_STACKUP::StackupAllowedBrdLayers ( )

inlinestatic

Returns: the board layers full mask allowed in the stackup list i.e. the SilkS, Mask, Paste and all copper layers

Definition at line 228 of file board_stackup.h.

References B_Mask, B_Paste, B_SilkS, LSET::ExternalCuMask(), F_Mask, F_Paste, F_SilkS, and LSET::InternalCuMask().

Referenced by BuildDefaultStackupList(), PANEL_SETUP_BOARD_STACKUP::ImportSettingsFrom(), PANEL_SETUP_BOARD_STACKUP::OnLayersOptionsChanged(), and PANEL_SETUP_BOARD_STACKUP::PANEL_SETUP_BOARD_STACKUP().

◆ SynchronizeWithBoard()

bool BOARD_STACKUP::SynchronizeWithBoard ( BOARD_DESIGN_SETTINGS * aSettings )

Synchronize the BOARD_STACKUP_ITEM* list with the board.

Not enabled layers are removed Missing layers are added

Parameters

aSettings,is the current board setting.

Returns: true if changes are made

Definition at line 405 of file board_stackup.cpp.

References BuildDefaultStackupList(), GetList(), BOARD_DESIGN_SETTINGS::GetStackupDescriptor(), m_CastellatedPads, m_EdgeConnectorConstraints, m_EdgePlating, m_FinishType, m_HasDielectricConstrains, m_list, and UNDEFINED_LAYER.

Referenced by GERBER_JOBFILE_WRITER::addJSONMaterialStackup(), and DRAWING_TOOL::DrawSpecificationStackup().

Member Data Documentation

◆ m_CastellatedPads

bool BOARD_STACKUP::m_CastellatedPads

True if castellated pads exist.

Definition at line 320 of file board_stackup.h.

Referenced by GERBER_JOBFILE_WRITER::addJSONGeneralSpecs(), BOARD_STACKUP(), BuildDefaultStackupList(), BuildStackupReport(), DRAWING_TOOL::DrawBoardCharacteristics(), FormatBoardStackup(), operator=(), PCB_PARSER::parseBoardStackup(), PANEL_SETUP_BOARD_FINISH::synchronizeWithBoard(), SynchronizeWithBoard(), PANEL_SETUP_BOARD_FINISH::TransferDataFromWindow(), and PANEL_SETUP_BOARD_STACKUP::TransferDataFromWindow().

◆ m_EdgeConnectorConstraints

BS_EDGE_CONNECTOR_CONSTRAINTS BOARD_STACKUP::m_EdgeConnectorConstraints

If the board has edge connector cards, some constrains can be specified in job file: BS_EDGE_CONNECTOR_NONE = no edge connector BS_EDGE_CONNECTOR_IN_USE = board has edge connectors BS_EDGE_CONNECTOR_BEVELLED = edge connectors are beveled.

Definition at line 318 of file board_stackup.h.

Referenced by GERBER_JOBFILE_WRITER::addJSONGeneralSpecs(), BOARD_STACKUP(), BuildDefaultStackupList(), BuildStackupReport(), DRAWING_TOOL::DrawBoardCharacteristics(), FormatBoardStackup(), operator=(), PCB_PARSER::parseBoardStackup(), PANEL_SETUP_BOARD_FINISH::synchronizeWithBoard(), SynchronizeWithBoard(), PANEL_SETUP_BOARD_FINISH::TransferDataFromWindow(), and PANEL_SETUP_BOARD_STACKUP::TransferDataFromWindow().

◆ m_EdgePlating

bool BOARD_STACKUP::m_EdgePlating

True if the edge board is plated.

Definition at line 321 of file board_stackup.h.

Referenced by GERBER_JOBFILE_WRITER::addJSONGeneralSpecs(), BOARD_STACKUP(), BuildDefaultStackupList(), BuildStackupReport(), DRAWING_TOOL::DrawBoardCharacteristics(), FormatBoardStackup(), operator=(), PCB_PARSER::parseBoardStackup(), PANEL_SETUP_BOARD_FINISH::synchronizeWithBoard(), SynchronizeWithBoard(), PANEL_SETUP_BOARD_FINISH::TransferDataFromWindow(), and PANEL_SETUP_BOARD_STACKUP::TransferDataFromWindow().

◆ m_FinishType

wxString BOARD_STACKUP::m_FinishType

The name of external copper finish.

Definition at line 295 of file board_stackup.h.

Referenced by GERBER_JOBFILE_WRITER::addJSONGeneralSpecs(), BOARD_STACKUP(), BuildDefaultStackupList(), BuildStackupReport(), DRAWING_TOOL::DrawBoardCharacteristics(), EXPORTER_PCB_VRML::EXPORTER_PCB_VRML(), FormatBoardStackup(), BOARD_ADAPTER::InitSettings(), operator=(), PCB_PARSER::parseBoardStackup(), PANEL_SETUP_BOARD_FINISH::synchronizeWithBoard(), SynchronizeWithBoard(), PANEL_SETUP_BOARD_FINISH::TransferDataFromWindow(), and PANEL_SETUP_BOARD_STACKUP::TransferDataFromWindow().

◆ m_HasDielectricConstrains

bool BOARD_STACKUP::m_HasDielectricConstrains

True if some layers have impedance controlled tracks or have specific constrains for micro-wave applications If the board has dielectric constrains, the .gbrjob will contain info about dielectric constrains: loss tangent and Epsilon rel.

If not, these values will be not specified in job file.

Definition at line 304 of file board_stackup.h.

Referenced by GERBER_JOBFILE_WRITER::addJSONGeneralSpecs(), GERBER_JOBFILE_WRITER::addJSONMaterialStackup(), BOARD_STACKUP(), BuildStackupReport(), DRAWING_TOOL::DrawBoardCharacteristics(), FormatBoardStackup(), operator=(), PCB_PARSER::parseBoardStackup(), SynchronizeWithBoard(), PANEL_SETUP_BOARD_STACKUP::synchronizeWithBoard(), PANEL_SETUP_BOARD_STACKUP::transferDataFromUIToStackup(), and PANEL_SETUP_BOARD_STACKUP::TransferDataFromWindow().

◆ m_HasThicknessConstrains

bool BOARD_STACKUP::m_HasThicknessConstrains

True if some layers (copper and/or dielectric) have specific thickness.

Definition at line 309 of file board_stackup.h.

Referenced by BOARD_STACKUP(), and operator=().

◆ m_list

std::vector<BOARD_STACKUP_ITEM*> BOARD_STACKUP::m_list

private

Definition at line 326 of file board_stackup.h.

Referenced by Add(), BOARD_STACKUP(), BuildBoardThicknessFromStackup(), FormatBoardStackup(), GetCount(), GetLayerDistance(), GetList(), operator=(), RemoveAll(), and SynchronizeWithBoard().

The documentation for this class was generated from the following files:

Public Member Functions

Static Public Member Functions

Public Attributes

Private Attributes

Detailed Description

Constructor & Destructor Documentation

◆ BOARD_STACKUP() [1/2]

◆ BOARD_STACKUP() [2/2]

◆ ~BOARD_STACKUP()

Member Function Documentation

◆ Add()

◆ BuildBoardThicknessFromStackup()

◆ BuildDefaultStackupList()

◆ FormatBoardStackup()

◆ GetCount()

◆ GetLayerDistance()

◆ GetList()

◆ GetStackupLayer()

◆ operator=()

◆ RemoveAll()

◆ StackupAllowedBrdLayers()

◆ SynchronizeWithBoard()

Member Data Documentation

◆ m_CastellatedPads

◆ m_EdgeConnectorConstraints

◆ m_EdgePlating

◆ m_FinishType

◆ m_HasDielectricConstrains

◆ m_HasThicknessConstrains

◆ m_list