board_stackup.cpp

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/*
 * This program source code file is part of KiCad, a free EDA CAD application.
 *
 * Copyright (C) 2019 Jean-Pierre Charras, jp.charras at wanadoo.fr
 * Copyright (C) 2009-2021 KiCad Developers, see AUTHORS.txt for contributors.
 *
 * This program is free software; you can redistribute it and/or
 * modify it under the terms of the GNU General Public License
 * as published by the Free Software Foundation; either version 3
 * of the License, or (at your option) any later version.
 *
 * This program is distributed in the hope that it will be useful,
 * but WITHOUT ANY WARRANTY; without even the implied warranty of
 * MERCHANTABILITY or FITNESS FOR A PARTICULAR PURPOSE. See the
 * GNU General Public License for more details.
 *
 * You should have received a copy of the GNU General Public License along
 * with this program. If not, see <http://www.gnu.org/licenses/>.
 */
 
 
#include "board_stackup.h"
#include <base_units.h>
#include <string_utils.h>
#include <layer_ids.h>
#include <board_design_settings.h>
#include <board.h>
#include <i18n_utility.h> // For _HKI definition
#include "stackup_predefined_prms.h"
 
 
BOARD_STACKUP_ITEM::BOARD_STACKUP_ITEM( BOARD_STACKUP_ITEM_TYPE aType )
{
 DIELECTRIC_PRMS item_prms;
 m_DielectricPrmsList.emplace_back( item_prms );
 m_LayerId = UNDEFINED_LAYER;
 m_Type = aType;
 SetDielectricLayerId( 1 );
 SetEnabled( true );
 
 // Initialize parameters to a usual value for allowed types:
 switch( m_Type )
 {
 case BS_ITEM_TYPE_COPPER:
 m_TypeName = KEY_COPPER;
 SetThickness( GetCopperDefaultThickness() );
 break;
 
 case BS_ITEM_TYPE_DIELECTRIC:
 m_TypeName = KEY_CORE; // or prepreg
 SetColor( NotSpecifiedPrm() );
 SetMaterial( wxT( "FR4" ) ); // or other dielectric name
 SetLossTangent( 0.02 ); // for FR4
 SetEpsilonR( 4.5 ); // for FR4
 break;
 
 case BS_ITEM_TYPE_SOLDERPASTE:
 m_TypeName = wxT( "solderpaste" );
 break;
 
 case BS_ITEM_TYPE_SOLDERMASK:
 m_TypeName = wxT( "soldermask" );
 SetColor( NotSpecifiedPrm() );
 SetMaterial( NotSpecifiedPrm() ); // or other solder mask material name
 SetThickness( GetMaskDefaultThickness() );
 SetEpsilonR( DEFAULT_EPSILON_R_SOLDERMASK );
 break;
 
 case BS_ITEM_TYPE_SILKSCREEN:
 m_TypeName = wxT( "silkscreen" );
 SetColor( NotSpecifiedPrm() );
 SetMaterial( NotSpecifiedPrm() ); // or other silkscreen material name
 SetEpsilonR( DEFAULT_EPSILON_R_SILKSCREEN );
 break;
 
 case BS_ITEM_TYPE_UNDEFINED:
 break;
 }
}
 
 
BOARD_STACKUP_ITEM::BOARD_STACKUP_ITEM( const BOARD_STACKUP_ITEM& aOther )
{
 m_LayerId = aOther.m_LayerId;
 m_DielectricLayerId = aOther.m_DielectricLayerId;
 m_Type = aOther.m_Type;
 m_enabled = aOther.m_enabled;
 m_DielectricPrmsList = aOther.m_DielectricPrmsList;
 m_TypeName = aOther.m_TypeName;
 m_LayerName = aOther.m_LayerName;
}
 
 
void BOARD_STACKUP_ITEM::AddDielectricPrms( int aDielectricPrmsIdx )
{
 // add a DIELECTRIC_PRMS item to m_DielectricPrmsList
 DIELECTRIC_PRMS new_prms;
 
 m_DielectricPrmsList.emplace( m_DielectricPrmsList.begin() + aDielectricPrmsIdx, new_prms );
}
 
 
void BOARD_STACKUP_ITEM::RemoveDielectricPrms( int aDielectricPrmsIdx )
{
 // Remove a DIELECTRIC_PRMS item from m_DielectricPrmsList if possible
 
 if( GetSublayersCount() < 2
 || aDielectricPrmsIdx < 0
 || aDielectricPrmsIdx >= GetSublayersCount() )
 {
 return;
 }
 
 m_DielectricPrmsList.erase( m_DielectricPrmsList.begin() + aDielectricPrmsIdx );
}
 
 
 
int BOARD_STACKUP_ITEM::GetCopperDefaultThickness()
{
 // A reasonable thickness for copper layers:
 return pcbIUScale.mmToIU( 0.035 );
}
 
 
int BOARD_STACKUP_ITEM::GetMaskDefaultThickness()
{
 // A reasonable thickness for solder mask:
 return pcbIUScale.mmToIU( 0.01 );
}
 
 
// Getters:
wxString BOARD_STACKUP_ITEM::GetColor( int aDielectricSubLayer ) const
{
 wxASSERT( aDielectricSubLayer >= 0 && aDielectricSubLayer < GetSublayersCount() );
 
 return m_DielectricPrmsList[aDielectricSubLayer].m_Color;
}
 
int BOARD_STACKUP_ITEM::GetThickness( int aDielectricSubLayer ) const
{
 wxASSERT( aDielectricSubLayer >= 0 && aDielectricSubLayer < GetSublayersCount() );
 
 return m_DielectricPrmsList[aDielectricSubLayer].m_Thickness;
}
 
 
double BOARD_STACKUP_ITEM::GetLossTangent( int aDielectricSubLayer ) const
{
 wxASSERT( aDielectricSubLayer >= 0 && aDielectricSubLayer < GetSublayersCount() );
 
 return m_DielectricPrmsList[aDielectricSubLayer].m_LossTangent;
}
 
 
double BOARD_STACKUP_ITEM::GetEpsilonR( int aDielectricSubLayer ) const
{
 wxASSERT( aDielectricSubLayer >= 0 && aDielectricSubLayer < GetSublayersCount() );
 
 return m_DielectricPrmsList[aDielectricSubLayer].m_EpsilonR;
}
 
 
bool BOARD_STACKUP_ITEM::IsThicknessLocked( int aDielectricSubLayer ) const
{
 wxASSERT( aDielectricSubLayer >= 0 && aDielectricSubLayer < GetSublayersCount() );
 
 return m_DielectricPrmsList[aDielectricSubLayer].m_ThicknessLocked;
}
 
 
wxString BOARD_STACKUP_ITEM::GetMaterial( int aDielectricSubLayer ) const
{
 wxASSERT( aDielectricSubLayer >= 0 && aDielectricSubLayer < GetSublayersCount() );
 
 return m_DielectricPrmsList[aDielectricSubLayer].m_Material;
}
 
 
// Setters:
void BOARD_STACKUP_ITEM::SetColor( const wxString& aColorName , int aDielectricSubLayer )
{
 wxASSERT( aDielectricSubLayer >= 0 && aDielectricSubLayer < GetSublayersCount() );
 
 if( aDielectricSubLayer >= 0 && aDielectricSubLayer < GetSublayersCount() )
 m_DielectricPrmsList[aDielectricSubLayer].m_Color = aColorName;
}
 
 
void BOARD_STACKUP_ITEM::SetThickness( int aThickness, int aDielectricSubLayer )
{
 wxASSERT( aDielectricSubLayer >= 0 && aDielectricSubLayer < GetSublayersCount() );
 
 if( aDielectricSubLayer >= 0 && aDielectricSubLayer < GetSublayersCount() )
 m_DielectricPrmsList[aDielectricSubLayer].m_Thickness = aThickness;
}
 
 
void BOARD_STACKUP_ITEM::SetLossTangent( double aTg, int aDielectricSubLayer )
{
 wxASSERT( aDielectricSubLayer >= 0 && aDielectricSubLayer < GetSublayersCount() );
 
 if( aDielectricSubLayer >= 0 && aDielectricSubLayer < GetSublayersCount() )
 m_DielectricPrmsList[aDielectricSubLayer].m_LossTangent = aTg;
}
 
 
void BOARD_STACKUP_ITEM::SetEpsilonR( double aEpsilon, int aDielectricSubLayer )
{
 wxASSERT( aDielectricSubLayer >= 0 && aDielectricSubLayer < GetSublayersCount() );
 
 if( aDielectricSubLayer >= 0 && aDielectricSubLayer < GetSublayersCount() )
 m_DielectricPrmsList[aDielectricSubLayer].m_EpsilonR = aEpsilon;
}
 
 
void BOARD_STACKUP_ITEM::SetThicknessLocked( bool aLocked, int aDielectricSubLayer )
{
 wxASSERT( aDielectricSubLayer >= 0 && aDielectricSubLayer < GetSublayersCount() );
 
 if( aDielectricSubLayer >= 0 && aDielectricSubLayer < GetSublayersCount() )
 m_DielectricPrmsList[aDielectricSubLayer].m_ThicknessLocked = aLocked;
}
 
 
void BOARD_STACKUP_ITEM::SetMaterial( const wxString& aName, int aDielectricSubLayer )
{
 wxASSERT( aDielectricSubLayer >= 0 && aDielectricSubLayer < GetSublayersCount() );
 
 if( aDielectricSubLayer >= 0 && aDielectricSubLayer < GetSublayersCount() )
 m_DielectricPrmsList[aDielectricSubLayer].m_Material = aName;
}
 
 
bool BOARD_STACKUP_ITEM::HasEpsilonRValue() const
{
 return m_Type == BS_ITEM_TYPE_DIELECTRIC
 || m_Type == BS_ITEM_TYPE_SOLDERMASK;
};
 
 
bool BOARD_STACKUP_ITEM::HasLossTangentValue() const
{
 return m_Type == BS_ITEM_TYPE_DIELECTRIC
 || m_Type == BS_ITEM_TYPE_SOLDERMASK;
};
 
 
bool BOARD_STACKUP_ITEM::HasMaterialValue( int aDielectricSubLayer ) const
{
 // return true if the material is specified
 return IsMaterialEditable() && IsPrmSpecified( GetMaterial( aDielectricSubLayer ) );
}
 
 
bool BOARD_STACKUP_ITEM::IsMaterialEditable() const
{
 return m_Type == BS_ITEM_TYPE_DIELECTRIC
 || m_Type == BS_ITEM_TYPE_SOLDERMASK
 || m_Type == BS_ITEM_TYPE_SILKSCREEN;
}
 
 
bool BOARD_STACKUP_ITEM::IsColorEditable() const
{
 return m_Type == BS_ITEM_TYPE_DIELECTRIC
 || m_Type == BS_ITEM_TYPE_SOLDERMASK
 || m_Type == BS_ITEM_TYPE_SILKSCREEN;
}
 
 
bool BOARD_STACKUP_ITEM::IsThicknessEditable() const
{
 return m_Type == BS_ITEM_TYPE_COPPER
 || m_Type == BS_ITEM_TYPE_DIELECTRIC
 || m_Type == BS_ITEM_TYPE_SOLDERMASK;
}
 
 
wxString BOARD_STACKUP_ITEM::FormatEpsilonR( int aDielectricSubLayer ) const
{
 // return a wxString to print/display Epsilon R
 // note: we do not want scientific notation
 wxString txt = UIDouble2Str( GetEpsilonR( aDielectricSubLayer ) );
 return txt;
}
 
 
wxString BOARD_STACKUP_ITEM::FormatLossTangent( int aDielectricSubLayer ) const
{
 // return a wxString to print/display Loss Tangent
 // note: we do not want scientific notation
 wxString txt = UIDouble2Str( GetLossTangent( aDielectricSubLayer ) );
 return txt;
}
 
 
wxString BOARD_STACKUP_ITEM::FormatDielectricLayerName() const
{
 // return a wxString to print/display a dielectric name
 wxString lname;
 lname.Printf( _( "Dielectric %d" ), GetDielectricLayerId() );
 
 return lname;
}
 
 
BOARD_STACKUP::BOARD_STACKUP()
{
 m_HasDielectricConstrains = false; // True if some dielectric layers have constrains
 // (Loss tg and Epison R)
 m_HasThicknessConstrains = false; // True if some dielectric or copper layers have constrains
 m_EdgeConnectorConstraints = BS_EDGE_CONNECTOR_NONE;
 m_CastellatedPads = false; // True if some castellated pads exist
 m_EdgePlating = false; // True if edge board is plated
 m_FinishType = wxT( "None" ); // undefined finish type
}
 
 
BOARD_STACKUP::BOARD_STACKUP( const BOARD_STACKUP& aOther )
{
 m_HasDielectricConstrains = aOther.m_HasDielectricConstrains;
 m_HasThicknessConstrains = aOther.m_HasThicknessConstrains;
 m_EdgeConnectorConstraints = aOther.m_EdgeConnectorConstraints;
 m_CastellatedPads = aOther.m_CastellatedPads;
 m_EdgePlating = aOther.m_EdgePlating;
 m_FinishType = aOther.m_FinishType;
 
 // All items in aOther.m_list have to be duplicated, because aOther.m_list
 // manage pointers to these items
 for( BOARD_STACKUP_ITEM* item : aOther.m_list )
 {
 BOARD_STACKUP_ITEM* dup_item = new BOARD_STACKUP_ITEM( *item );
 Add( dup_item );
 }
}
 
 
BOARD_STACKUP& BOARD_STACKUP::operator=( const BOARD_STACKUP& aOther )
{
 m_HasDielectricConstrains = aOther.m_HasDielectricConstrains;
 m_HasThicknessConstrains = aOther.m_HasThicknessConstrains;
 m_EdgeConnectorConstraints = aOther.m_EdgeConnectorConstraints;
 m_CastellatedPads = aOther.m_CastellatedPads;
 m_EdgePlating = aOther.m_EdgePlating;
 m_FinishType = aOther.m_FinishType;
 
 RemoveAll();
 
 // All items in aOther.m_list have to be duplicated, because aOther.m_list
 // manage pointers to these items
 for( BOARD_STACKUP_ITEM* item : aOther.m_list )
 {
 BOARD_STACKUP_ITEM* dup_item = new BOARD_STACKUP_ITEM( *item );
 Add( dup_item );
 }
 
 return *this;
}
 
 
void BOARD_STACKUP::RemoveAll()
{
 for( BOARD_STACKUP_ITEM* item : m_list )
 delete item;
 
 m_list.clear();
}
 
 
BOARD_STACKUP_ITEM* BOARD_STACKUP::GetStackupLayer( int aIndex )
{
 if( aIndex < 0 || aIndex >= GetCount() )
 return nullptr;
 
 return GetList()[aIndex];
}
 
 
int BOARD_STACKUP::BuildBoardThicknessFromStackup() const
{
 // return the board thickness from the thickness of BOARD_STACKUP_ITEM list
 int thickness = 0;
 
 for( BOARD_STACKUP_ITEM* item : m_list )
 {
 if( item->IsThicknessEditable() && item->IsEnabled() )
 {
 thickness += item->GetThickness();
 
 // dielectric layers can have more than one main layer
 // add thickness of all sublayers
 for( int idx = 1; idx < item->GetSublayersCount(); idx++ )
 {
 thickness += item->GetThickness( idx );
 }
 }
 }
 
 return thickness;
}
 
 
bool BOARD_STACKUP::SynchronizeWithBoard( BOARD_DESIGN_SETTINGS* aSettings )
{
 bool change = false;
 // Build the suitable stackup:
 BOARD_STACKUP stackup;
 stackup.BuildDefaultStackupList( aSettings );
 
 // First, find removed layers:
 for( BOARD_STACKUP_ITEM* curr_item: m_list )
 {
 bool found = false;
 
 for( BOARD_STACKUP_ITEM* item: stackup.GetList() )
 {
 if( curr_item->GetBrdLayerId() != UNDEFINED_LAYER )
 {
 if( item->GetBrdLayerId() == curr_item->GetBrdLayerId() )
 {
 found = true;
 break;
 }
 }
 else // curr_item = dielectric layer
 {
 if( item->GetBrdLayerId() != UNDEFINED_LAYER )
 continue;
 
 if( item->GetDielectricLayerId() == curr_item->GetDielectricLayerId() )
 {
 found = true;
 break;
 }
 }
 }
 
 if( !found ) // a layer was removed: a change is found
 {
 change = true;
 break;
 }
 }
 
 // Now initialize all stackup items to the initial values, when exist
 for( BOARD_STACKUP_ITEM* item : stackup.GetList() )
 {
 bool found = false;
 // Search for initial settings:
 for( const BOARD_STACKUP_ITEM* initial_item : m_list )
 {
 if( item->GetBrdLayerId() != UNDEFINED_LAYER )
 {
 if( item->GetBrdLayerId() == initial_item->GetBrdLayerId() )
 {
 *item = *initial_item;
 found = true;
 break;
 }
 }
 else // dielectric layer: see m_DielectricLayerId for identification
 {
 // Compare dielectric layer with dielectric layer
 if( initial_item->GetBrdLayerId() != UNDEFINED_LAYER )
 continue;
 
 if( item->GetDielectricLayerId() == initial_item->GetDielectricLayerId() )
 {
 *item = *initial_item;
 found = true;
 break;
 }
 }
 }
 
 if( !found )
 {
 change = true;
 }
 }
 
 // Transfer layer settings:
 *this = stackup;
 
 // Transfer other stackup settings from aSettings
 const BOARD_STACKUP& source_stackup = aSettings->GetStackupDescriptor();
 m_HasDielectricConstrains = source_stackup.m_HasDielectricConstrains;
 m_EdgeConnectorConstraints = source_stackup.m_EdgeConnectorConstraints;
 m_CastellatedPads = source_stackup.m_CastellatedPads;
 m_EdgePlating = source_stackup.m_EdgePlating;
 m_FinishType = source_stackup.m_FinishType;
 
 return change;
}
 
 
void BOARD_STACKUP::BuildDefaultStackupList( const BOARD_DESIGN_SETTINGS* aSettings,
 int aActiveCopperLayersCount )
{
 // Creates a default stackup, according to the current BOARD_DESIGN_SETTINGS settings.
 // Note: the m_TypeName string is made translatable using _HKI marker, but is not
 // translated when building the stackup.
 // It will be used as this in files, and can be translated only in dialog
 // if aSettings == NULL, build a full stackup (with 32 copper layers)
 LSET enabledLayer = aSettings ? aSettings->GetEnabledLayers() : StackupAllowedBrdLayers();
 int copperLayerCount = aSettings ? aSettings->GetCopperLayerCount() : B_Cu+1;
 
 // We need to calculate a suitable dielectric layer thickness.
 // If no settings, and if aActiveCopperLayersCount is given, use it
 // (If no settings, and no aActiveCopperLayersCount, the full 32 layers are used)
 int activeCuLayerCount = copperLayerCount;
 
 if( aSettings == nullptr && aActiveCopperLayersCount > 0 )
 activeCuLayerCount = aActiveCopperLayersCount;
 
 int brd__thickness = aSettings ? aSettings->GetBoardThickness() : pcbIUScale.mmToIU( 1.6 );
 int diel_thickness = brd__thickness -
 ( BOARD_STACKUP_ITEM::GetCopperDefaultThickness() * activeCuLayerCount );
 
 // Take in account the solder mask thickness:
 int sm_count = ( enabledLayer & LSET( 2, F_Mask, B_Mask) ).count();
 diel_thickness -= BOARD_STACKUP_ITEM::GetMaskDefaultThickness() * sm_count;
 diel_thickness /= std::max( 1, activeCuLayerCount - 1 );
 
 int dielectric_idx = 0;
 
 // Add silk screen, solder mask and solder paste layers on top
 if( enabledLayer[F_SilkS] )
 {
 BOARD_STACKUP_ITEM* item = new BOARD_STACKUP_ITEM( BS_ITEM_TYPE_SILKSCREEN );
 item->SetBrdLayerId( F_SilkS );
 item->SetTypeName( _HKI( "Top Silk Screen" ) );
 Add( item );
 }
 
 if( enabledLayer[F_Paste] )
 {
 BOARD_STACKUP_ITEM* item = new BOARD_STACKUP_ITEM( BS_ITEM_TYPE_SOLDERPASTE );
 item->SetBrdLayerId( F_Paste );
 item->SetTypeName( _HKI( "Top Solder Paste" ) );
 Add( item );
 }
 
 if( enabledLayer[F_Mask] )
 {
 BOARD_STACKUP_ITEM* item = new BOARD_STACKUP_ITEM( BS_ITEM_TYPE_SOLDERMASK );
 item->SetBrdLayerId( F_Mask );
 item->SetTypeName( _HKI( "Top Solder Mask" ) );
 Add( item );
 }
 
 // Add copper and dielectric layers
 for( int ii = 0; ii < copperLayerCount; ii++ )
 {
 BOARD_STACKUP_ITEM* item = new BOARD_STACKUP_ITEM( BS_ITEM_TYPE_COPPER );
 item->SetBrdLayerId( ( PCB_LAYER_ID )ii );
 item->SetTypeName( KEY_COPPER );
 Add( item );
 
 if( ii == copperLayerCount-1 )
 {
 item->SetBrdLayerId( B_Cu );
 break;
 }
 
 // Add the dielectric layer:
 item = new BOARD_STACKUP_ITEM( BS_ITEM_TYPE_DIELECTRIC );
 item->SetThickness( diel_thickness );
 item->SetDielectricLayerId( dielectric_idx + 1 );
 
 // Display a dielectric default layer name:
 if( (dielectric_idx & 1) == 0 )
 {
 item->SetTypeName( KEY_CORE );
 item->SetMaterial( wxT( "FR4" ) );
 }
 else
 {
 item->SetTypeName( KEY_PREPREG );
 item->SetMaterial( wxT( "FR4" ) );
 }
 
 Add( item );
 dielectric_idx++;
 }
 
 // Add silk screen, solder mask and solder paste layers on bottom
 if( enabledLayer[B_Mask] )
 {
 BOARD_STACKUP_ITEM* item = new BOARD_STACKUP_ITEM( BS_ITEM_TYPE_SOLDERMASK );
 item->SetBrdLayerId( B_Mask );
 item->SetTypeName( _HKI( "Bottom Solder Mask" ) );
 Add( item );
 }
 
 if( enabledLayer[B_Paste] )
 {
 BOARD_STACKUP_ITEM* item = new BOARD_STACKUP_ITEM( BS_ITEM_TYPE_SOLDERPASTE );
 item->SetBrdLayerId( B_Paste );
 item->SetTypeName( _HKI( "Bottom Solder Paste" ) );
 Add( item );
 }
 
 if( enabledLayer[B_SilkS] )
 {
 BOARD_STACKUP_ITEM* item = new BOARD_STACKUP_ITEM( BS_ITEM_TYPE_SILKSCREEN );
 item->SetBrdLayerId( B_SilkS );
 item->SetTypeName( _HKI( "Bottom Silk Screen" ) );
 Add( item );
 }
 
 // Transfer other stackup settings from aSettings
 if( aSettings )
 {
 const BOARD_STACKUP& source_stackup = aSettings->GetStackupDescriptor();
 m_EdgeConnectorConstraints = source_stackup.m_EdgeConnectorConstraints;
 m_HasDielectricConstrains = source_stackup.m_HasDielectricConstrains;
 m_CastellatedPads = source_stackup.m_CastellatedPads;
 m_EdgePlating = source_stackup.m_EdgePlating;
 m_FinishType = source_stackup.m_FinishType;
 }
}
 
 
void BOARD_STACKUP::FormatBoardStackup( OUTPUTFORMATTER* aFormatter,
 const BOARD* aBoard, int aNestLevel ) const
{
 // Board stackup is the ordered list from top to bottom of
 // physical layers and substrate used to build the board.
 if( m_list.empty() )
 return;
 
 aFormatter->Print( aNestLevel, "(stackup\n" );
 int nest_level = aNestLevel+1;
 
 // Note:
 // Unspecified parameters are not stored in file.
 for( BOARD_STACKUP_ITEM* item: m_list )
 {
 wxString layer_name;
 
 if( item->GetBrdLayerId() == UNDEFINED_LAYER )
 layer_name.Printf( wxT( "dielectric %d" ), item->GetDielectricLayerId() );
 else
 layer_name = LSET::Name( item->GetBrdLayerId() );
 
 aFormatter->Print( nest_level, "(layer %s (type %s)",
 aFormatter->Quotew( layer_name ).c_str(),
 aFormatter->Quotew( item->GetTypeName() ).c_str() );
 
 // Output other parameters ( in sub layer list there is at least one item)
 for( int idx = 0; idx < item->GetSublayersCount(); idx++ )
 {
 if( idx ) // not for the main (first) layer.
 {
 aFormatter->Print( 0, "\n" );
 aFormatter->Print( nest_level+1, "addsublayer" );
 }
 
 if( item->IsColorEditable() && IsPrmSpecified( item->GetColor( idx ) ) )
 {
 aFormatter->Print( 0, " (color %s)",
 aFormatter->Quotew( item->GetColor( idx ) ).c_str() );
 }
 
 if( item->IsThicknessEditable() )
 {
 if( item->GetType() == BS_ITEM_TYPE_DIELECTRIC && item->IsThicknessLocked( idx ) )
 aFormatter->Print( 0, " (thickness %s locked)",
 EDA_UNIT_UTILS::FormatInternalUnits( pcbIUScale, item->GetThickness( idx ) ).c_str() );
 else
 aFormatter->Print( 0, " (thickness %s)",
 EDA_UNIT_UTILS::FormatInternalUnits( pcbIUScale, item->GetThickness( idx ) ).c_str() );
 }
 
 if( item->HasMaterialValue( idx ) )
 aFormatter->Print( 0, " (material %s)",
 aFormatter->Quotew( item->GetMaterial( idx ) ).c_str() );
 
 if( item->HasEpsilonRValue() && item->HasMaterialValue( idx ) )
 aFormatter->Print( 0, " (epsilon_r %g)", item->GetEpsilonR( idx ) );
 
 if( item->HasLossTangentValue() && item->HasMaterialValue( idx ) )
 aFormatter->Print( 0, " (loss_tangent %s)",
 FormatDouble2Str( item->GetLossTangent( idx ) ).c_str() );
 }
 
 aFormatter->Print( 0, ")\n" );
 }
 
 // Other infos about board, related to layers and other fabrication specifications
 if( IsPrmSpecified( m_FinishType ) )
 {
 aFormatter->Print( nest_level, "(copper_finish %s)\n",
 aFormatter->Quotew( m_FinishType ).c_str() );
 }
 
 aFormatter->Print( nest_level, "(dielectric_constraints %s)\n",
 m_HasDielectricConstrains ? "yes" : "no" );
 
 if( m_EdgeConnectorConstraints > 0 )
 {
 aFormatter->Print( nest_level, "(edge_connector %s)\n",
 m_EdgeConnectorConstraints > 1 ? "bevelled": "yes" );
 }
 
 if( m_CastellatedPads )
 aFormatter->Print( nest_level, "(castellated_pads yes)\n" );
 
 if( m_EdgePlating )
 aFormatter->Print( nest_level, "(edge_plating yes)\n" );
 
 aFormatter->Print( aNestLevel, ")\n" );
}
 
 
int BOARD_STACKUP::GetLayerDistance( PCB_LAYER_ID aFirstLayer, PCB_LAYER_ID aSecondLayer ) const
{
 wxASSERT( IsCopperLayer( aFirstLayer ) && IsCopperLayer( aSecondLayer ) );
 
 if( aFirstLayer == aSecondLayer )
 return 0;
 
 if( aSecondLayer < aFirstLayer )
 std::swap( aFirstLayer, aSecondLayer );
 
 int total = 0;
 bool start = false;
 bool half = false;
 
 for( BOARD_STACKUP_ITEM* item : m_list )
 {
 // Will be UNDEFINED_LAYER for dielectrics
 PCB_LAYER_ID layer = item->GetBrdLayerId();
 
 if( layer != UNDEFINED_LAYER && !IsCopperLayer( layer ) )
 continue; // Silk/mask layer
 
 // Reached the start copper layer? Start counting the next dielectric after it
 if( !start && ( layer != UNDEFINED_LAYER && layer >= aFirstLayer ) )
 {
 start = true;
 half = true;
 }
 else if( !start )
 continue;
 
 // Reached the stop copper layer? we're done
 if( start && ( layer != UNDEFINED_LAYER && layer >= aSecondLayer ) )
 half = true;
 
 for( int sublayer = 0; sublayer < item->GetSublayersCount(); sublayer++ )
 {
 int subThickness = item->GetThickness( sublayer );
 total += half ? ( subThickness / 2 ) : subThickness;
 }
 
 half = false;
 
 if( layer != UNDEFINED_LAYER && layer >= aSecondLayer )
 break;
 }
 
 return total;
}
 
 
bool IsPrmSpecified( const wxString& aPrmValue )
{
 // return true if the param value is specified:
 
 if( !aPrmValue.IsEmpty()
 && ( aPrmValue.CmpNoCase( NotSpecifiedPrm() ) != 0 )
 && aPrmValue != wxGetTranslation( NotSpecifiedPrm() ) )
 return true;
 
 return false;
}