step_pcb_model.h

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/*
 * This program source code file is part of KiCad, a free EDA CAD application.
 *
 * Copyright (C) 2016 Cirilo Bernardo <[email protected]>
 * Copyright (C) 2021-2024 KiCad Developers, see AUTHORS.txt for contributors.
 *
 * This program is free software; you can redistribute it and/or
 * modify it under the terms of the GNU General Public License
 * as published by the Free Software Foundation; either version 2
 * of the License, or (at your option) any later version.
 *
 * This program is distributed in the hope that it will be useful,
 * but WITHOUT ANY WARRANTY; without even the implied warranty of
 * MERCHANTABILITY or FITNESS FOR A PARTICULAR PURPOSE. See the
 * GNU General Public License for more details.
 *
 * You should have received a copy of the GNU General Public License
 * along with this program; if not, you may find one here:
 * http://www.gnu.org/licenses/old-licenses/gpl-2.0.html
 * or you may search the http://www.gnu.org website for the version 2 license,
 * or you may write to the Free Software Foundation, Inc.,
 * 51 Franklin Street, Fifth Floor, Boston, MA 02110-1301, USA
 */
 
#ifndef OCE_VIS_OCE_UTILS_H
#define OCE_VIS_OCE_UTILS_H
 
#include <list>
#include <map>
#include <string>
#include <utility>
#include <vector>
 
#include <Standard_Handle.hxx>
#include <TDF_Label.hxx>
#include <TopoDS_Shape.hxx>
 
#include <math/vector2d.h>
#include <math/vector3.h>
#include <geometry/shape_poly_set.h>
#include <board_stackup_manager/board_stackup.h>
 
static constexpr double OCC_MAX_DISTANCE_TO_MERGE_POINTS = 0.001;
 
// default PCB thickness in mm
static constexpr double BOARD_THICKNESS_DEFAULT_MM = 1.6;
 
// minimum PCB thickness in mm (10 microns assumes a very thin polyimide film)
// must be > OCC_MAX_DISTANCE_TO_MERGE_POINTS
static constexpr double BOARD_THICKNESS_MIN_MM = 0.01;
 
// default copper thickness in mm
// must be > OCC_MAX_DISTANCE_TO_MERGE_POINTS
static constexpr double COPPER_THICKNESS_DEFAULT_MM = 0.035;
 
// Max error to approximate an arc by segments (in mm)
static constexpr double ARC_TO_SEGMENT_MAX_ERROR_MM = 0.005;
 
class PAD;
 
class TDocStd_Document;
class XCAFApp_Application;
class XCAFDoc_ShapeTool;
 
typedef std::pair< std::string, TDF_Label > MODEL_DATUM;
typedef std::map< std::string, TDF_Label > MODEL_MAP;
 
extern void ReportMessage( const wxString& aMessage );
 
class STEP_PCB_MODEL
{
public:
 STEP_PCB_MODEL( const wxString& aPcbName );
 virtual ~STEP_PCB_MODEL();
 
 // add a pad hole or slot (must be in final position)
 bool AddPadHole( const PAD* aPad, const VECTOR2D& aOrigin );
 
 // add a pad shape (must be in final position)
 bool AddPadShape( const PAD* aPad, const VECTOR2D& aOrigin, bool aVia );
 
 // add a via shape
 bool AddViaShape( const PCB_VIA* aVia, const VECTOR2D& aOrigin );
 
 // add a track segment shape (do not use it for track arcs)
 bool AddTrackSegment( const PCB_TRACK* aTrack, const VECTOR2D& aOrigin );
 
 // add a set of polygons (must be in final position) on top or bottom of the board as copper
 bool AddCopperPolygonShapes( const SHAPE_POLY_SET* aPolyShapes, PCB_LAYER_ID aLayer,
 const VECTOR2D& aOrigin, bool aTrack );
 
 // add a component at the given position and orientation
 bool AddComponent( const std::string& aFileName, const std::string& aRefDes, bool aBottom,
 VECTOR2D aPosition, double aRotation, VECTOR3D aOffset,
 VECTOR3D aOrientation, VECTOR3D aScale, bool aSubstituteModels = true );
 
 void SetBoardColor( double r, double g, double b );
 void SetCopperColor( double r, double g, double b );
 
 void SetEnabledLayers( const LSET& aLayers );
 
 void SetFuseShapes( bool aValue );
 
 void SetStackup( const BOARD_STACKUP& aStackup );
 
 void SetNetFilter( const wxString& aFilter );
 
 // Set the max distance (in mm) to consider 2 points have the same coordinates
 // and can be merged
 void OCCSetMergeMaxDistance( double aDistance = OCC_MAX_DISTANCE_TO_MERGE_POINTS );
 
 void SetMaxError( int aMaxError ) { m_maxError = aMaxError; }
 
 // create the PCB model using the current outlines and drill holes
 bool CreatePCB( SHAPE_POLY_SET& aOutline, VECTOR2D aOrigin, bool aPushBoardBody );
 
 bool MakeShapes( std::vector<TopoDS_Shape>& aShapes, const SHAPE_POLY_SET& aPolySet,
 bool aConvertToArcs, double aThickness, double aZposition,
 const VECTOR2D& aOrigin );
 
 bool MakeShapeAsCylinder( TopoDS_Shape& aShape, const SHAPE_LINE_CHAIN& aChain,
 double aThickness, double aZposition, const VECTOR2D& aOrigin );
 
 bool MakeShapeAsThickSegment( TopoDS_Shape& aShape,
 VECTOR2D aStartPoint, VECTOR2D aEndPoint,
 double aWidth, double aThickness, double aZposition,
 const VECTOR2D& aOrigin );
 
#ifdef SUPPORTS_IGES
 // write the assembly model in IGES format
 bool WriteIGES( const wxString& aFileName );
#endif
 
 // write the assembly model in STEP format
 bool WriteSTEP( const wxString& aFileName, bool aOptimize );
 
 // write the assembly in BREP format
 bool WriteBREP( const wxString& aFileName );
 
 // write the assembly in XAO format with pad faces as groups
 bool WriteXAO( const wxString& aFileName );
 
 bool WriteGLTF( const wxString& aFileName );
 
private:
 bool isBoardOutlineValid();
 
 void getLayerZPlacement( const PCB_LAYER_ID aLayer, double& aZPos, double& aThickness );
 
 void getBoardBodyZPlacement( double& aZPos, double& aThickness );
 
 bool getModelLabel( const std::string& aFileNameUTF8, VECTOR3D aScale, TDF_Label& aLabel,
 bool aSubstituteModels, wxString* aErrorMessage = nullptr );
 
 bool getModelLocation( bool aBottom, VECTOR2D aPosition, double aRotation, VECTOR3D aOffset,
 VECTOR3D aOrientation, TopLoc_Location& aLocation );
 
 bool readIGES( Handle( TDocStd_Document )& m_doc, const char* fname );
 bool readSTEP( Handle( TDocStd_Document )& m_doc, const char* fname );
 
 TDF_Label transferModel( Handle( TDocStd_Document )& source, Handle( TDocStd_Document ) & dest,
 VECTOR3D aScale );
 
 Handle( XCAFApp_Application ) m_app;
 Handle( TDocStd_Document ) m_doc;
 Handle( XCAFDoc_ShapeTool ) m_assy;
 TDF_Label m_assy_label;
 bool m_hasPCB; // set true if CreatePCB() has been invoked
 bool m_fuseShapes; // fuse geometry together
 int m_platingThickness; // plating thickness for TH pads/vias
 std::vector<TDF_Label> m_pcb_labels; // labels for the PCB model (one by main outline)
 MODEL_MAP m_models; // map of file names to model labels
 int m_components; // number of successfully loaded components;
 double m_precision; // model (length unit) numeric precision
 double m_angleprec; // angle numeric precision
 double m_boardColor[3]; // board body, RGB values
 double m_copperColor[3]; // copper, RGB values
 BOARD_STACKUP m_stackup; // board stackup
 LSET m_enabledLayers; // a set of layers enabled for export
 wxString m_netFilter; // remove nets not matching this wildcard
 
 double m_minx; // leftmost curve point
 double m_mergeOCCMaxDist; // minimum distance (mm) below which two
 // points are considered coincident by OCC
 
 // Holes in copper and main outlines
 std::vector<TopoDS_Shape> m_copperCutouts;
 std::vector<TopoDS_Shape> m_boardCutouts;
 
 // Main outlines (more than one board)
 std::vector<TopoDS_Shape> m_board_outlines;
 std::vector<TopoDS_Shape> m_board_copper_zones;
 std::vector<TopoDS_Shape> m_board_copper_tracks;
 std::vector<TopoDS_Shape> m_board_copper_pads;
 std::vector<TopoDS_Shape> m_board_copper_fused;
 
 // Data for pads
 std::map<wxString, std::pair<gp_Pnt, TopoDS_Shape>> m_pad_points;
 
 wxString m_pcbName;
 
 int m_maxError;
};
 
#endif // OCE_VIS_OCE_UTILS_H