step_pcb_model.h

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/*
 * This program source code file is part of KiCad, a free EDA CAD application.
 *
 * Copyright (C) 2016 Cirilo Bernardo <[email protected]>
 * Copyright The KiCad Developers, see AUTHORS.txt for contributors.
 *
 * This program is free software; you can redistribute it and/or
 * modify it under the terms of the GNU General Public License
 * as published by the Free Software Foundation; either version 2
 * of the License, or (at your option) any later version.
 *
 * This program is distributed in the hope that it will be useful,
 * but WITHOUT ANY WARRANTY; without even the implied warranty of
 * MERCHANTABILITY or FITNESS FOR A PARTICULAR PURPOSE.  See the
 * GNU General Public License for more details.
 *
 * You should have received a copy of the GNU General Public License
 * along with this program; if not, you may find one here:
 * http://www.gnu.org/licenses/old-licenses/gpl-2.0.html
 * or you may search the http://www.gnu.org website for the version 2 license,
 * or you may write to the Free Software Foundation, Inc.,
 * 51 Franklin Street, Fifth Floor, Boston, MA  02110-1301, USA
 */
 
#ifndef OCE_VIS_OCE_UTILS_H
#define OCE_VIS_OCE_UTILS_H
 
#include <list>
#include <map>
#include <string>
#include <utility>
#include <vector>
 
#include <Standard_Handle.hxx>
#include <TDF_Label.hxx>
#include <TopoDS_Shape.hxx>
 
#include <math/vector2d.h>
#include <math/vector3.h>
#include <geometry/shape_poly_set.h>
#include <board_stackup_manager/board_stackup.h>
 
static constexpr double OCC_MAX_DISTANCE_TO_MERGE_POINTS = 0.001;
 
// default PCB thickness in mm
static constexpr double BOARD_THICKNESS_DEFAULT_MM = 1.6;
 
// minimum PCB thickness in mm (10 microns assumes a very thin polyimide film)
// must be > OCC_MAX_DISTANCE_TO_MERGE_POINTS
static constexpr double BOARD_THICKNESS_MIN_MM = 0.01;
 
// default copper thickness in mm
// must be > OCC_MAX_DISTANCE_TO_MERGE_POINTS
static constexpr double COPPER_THICKNESS_DEFAULT_MM = 0.035;
 
// Max error to approximate an arc by segments (in mm)
static constexpr double ARC_TO_SEGMENT_MAX_ERROR_MM = 0.005;
 
class PAD;
 
class TDocStd_Document;
class XCAFApp_Application;
class XCAFDoc_ShapeTool;
 
typedef std::pair< std::string, TDF_Label > MODEL_DATUM;
typedef std::map< std::string, TDF_Label > MODEL_MAP;
 
 
enum class OUTPUT_FORMAT
{
    FMT_OUT_UNKNOWN = 0,
    FMT_OUT_STEP,
    FMT_OUT_STEPZ,
    FMT_OUT_IGES,
    FMT_OUT_BREP,
    FMT_OUT_XAO,
    FMT_OUT_GLTF,
    FMT_OUT_PLY,
    FMT_OUT_STL
};
 
class STEP_PCB_MODEL
{
public:
    STEP_PCB_MODEL( const wxString& aPcbName, REPORTER* aReporter );
    virtual ~STEP_PCB_MODEL();
 
    // Update m_outFmt to aVariant, giving the output format variant
    void SpecializeVariant( OUTPUT_FORMAT aVariant ) { m_outFmt = aVariant; }
 
    // add a pad shape (must be in final position)
    // if aClipPolygon is not nullptr, the pad shape will be clipped by aClipPolygon
    // (usually aClipPolygon is the board outlines and use for castelleted pads)
    bool AddPadShape( const PAD* aPad, const VECTOR2D& aOrigin, bool aVia,
                      SHAPE_POLY_SET* aClipPolygon = nullptr );
 
    // add a pad hole or slot (must be in final position)
    bool AddHole( const SHAPE_SEGMENT& aShape, int aPlatingThickness, PCB_LAYER_ID aLayerTop,
                  PCB_LAYER_ID aLayerBot, bool aVia, const VECTOR2D& aOrigin, bool aCutCopper,
                  bool aCutBody );
 
    // add a plated hole shape (without the hole)
    bool AddBarrel( const SHAPE_SEGMENT& aShape, PCB_LAYER_ID aLayerTop, PCB_LAYER_ID aLayerBot,
                    bool aVia, const VECTOR2D& aOrigin, const wxString& aNetname );
 
    // add a set of polygons (must be in final position)
    bool AddPolygonShapes( const SHAPE_POLY_SET* aPolyShapes, PCB_LAYER_ID aLayer,
                           const VECTOR2D& aOrigin, const wxString& aNetname );
 
    // add a component at the given position and orientation
    bool AddComponent( const std::string& aFileName, const std::string& aRefDes, bool aBottom,
                       VECTOR2D aPosition, double aRotation, VECTOR3D aOffset,
                       VECTOR3D aOrientation, VECTOR3D aScale, bool aSubstituteModels = true );
 
    void SetCopperColor( double r, double g, double b );
    void SetPadColor( double r, double g, double b );
 
    void SetEnabledLayers( const LSET& aLayers );
    void SetFuseShapes( bool aValue );
    void SetSimplifyShapes( bool aValue );
    void SetStackup( const BOARD_STACKUP& aStackup );
    void SetNetFilter( const wxString& aFilter );
 
    // Set the max distance (in mm) to consider 2 points have the same coordinates
    // and can be merged
    void OCCSetMergeMaxDistance( double aDistance = OCC_MAX_DISTANCE_TO_MERGE_POINTS );
 
    // create the PCB model using the current outlines and drill holes
    bool CreatePCB( SHAPE_POLY_SET& aOutline, VECTOR2D aOrigin, bool aPushBoardBody );
 
    bool MakeShapes( std::vector<TopoDS_Shape>& aShapes, const SHAPE_POLY_SET& aPolySet,
                     bool aConvertToArcs, double aThickness, double aZposition,
                     const VECTOR2D& aOrigin );
 
    bool MakeShapeAsThickSegment( TopoDS_Shape& aShape,
                                  VECTOR2D aStartPoint, VECTOR2D aEndPoint,
                                  double aWidth, double aThickness, double aZposition,
                                  const VECTOR2D& aOrigin );
 
    bool MakePolygonAsWall( TopoDS_Shape& aShape,
                            SHAPE_POLY_SET& aPolySet,
                            double aHeight,
                            double aZposition, const VECTOR2D& aOrigin );
 
#ifdef SUPPORTS_IGES
    // write the assembly model in IGES format
    bool WriteIGES( const wxString& aFileName );
#endif
 
    // write the assembly model in STEP format
    bool WriteSTEP( const wxString& aFileName, bool aOptimize, bool compress );
 
    // write the assembly in BREP format
    bool WriteBREP( const wxString& aFileName );
 
    // write the assembly in XAO format with pad faces as groups
    bool WriteXAO( const wxString& aFileName );
 
    bool WriteGLTF( const wxString& aFileName );
 
    // write the assembly in PLY format (mesh)
    bool WritePLY( const wxString& aFileName );
 
    // write the assembly in STL format (mesh)
    bool WriteSTL( const wxString& aFileName );
 
private:
    bool isBoardOutlineValid();
 
    void getLayerZPlacement( const PCB_LAYER_ID aLayer, double& aZPos, double& aThickness );
 
    void getCopperLayerZPlacement( const PCB_LAYER_ID aLayer, double& aZPos, double& aThickness );
 
    void getBoardBodyZPlacement( double& aZPos, double& aThickness );
 
    bool getModelLabel( const std::string& aFileNameUTF8, VECTOR3D aScale, TDF_Label& aLabel,
                        bool aSubstituteModels, wxString* aErrorMessage = nullptr );
 
    bool getModelLocation( bool aBottom, VECTOR2D aPosition, double aRotation, VECTOR3D aOffset,
                           VECTOR3D aOrientation, TopLoc_Location& aLocation );
 
    bool readIGES( Handle( TDocStd_Document ) & aDoc, const char* aFname );
    bool readSTEP( Handle( TDocStd_Document ) & aDoc, const char* aFname );
    bool readVRML( Handle( TDocStd_Document ) & aDoc, const char* aFname );
 
    bool performMeshing( Handle( XCAFDoc_ShapeTool ) & aShapeTool );
 
    TDF_Label transferModel( Handle( TDocStd_Document )& source, Handle( TDocStd_Document ) & dest,
                             VECTOR3D aScale );
 
    bool CompressSTEP( wxString& inputFile, wxString& outputFile );
 
    Handle( XCAFApp_Application )   m_app;
    Handle( TDocStd_Document )      m_doc;
    Handle( XCAFDoc_ShapeTool )     m_assy;
    TDF_Label                       m_assy_label;
    bool                            m_hasPCB;           // set true if CreatePCB() has been invoked
    bool                            m_simplifyShapes;   // convert parts of outlines to arcs where possible
    bool                            m_fuseShapes;       // fuse geometry together
    std::vector<TDF_Label>          m_pcb_labels;       // labels for the PCB model (one by main outline)
    MODEL_MAP                       m_models;           // map of file names to model labels
    int                             m_components;       // number of successfully loaded components;
    double                          m_precision;        // model (length unit) numeric precision
    double                          m_angleprec;        // angle numeric precision
    double                          m_copperColor[3];   // copper, RGB values
    double                          m_padColor[3];      // pads, RGB values
    BOARD_STACKUP                   m_stackup;          // board stackup
    LSET                            m_enabledLayers;    // a set of layers enabled for export
    wxString                        m_netFilter;        // remove nets not matching this wildcard
 
    double                          m_minx;             // leftmost curve point
    double                          m_mergeOCCMaxDist;  // minimum distance (mm) below which two
                                                        // points are considered coincident by OCC
 
    // Holes in copper and main outlines
    std::vector<TopoDS_Shape> m_copperCutouts;
    std::vector<TopoDS_Shape> m_boardCutouts;
 
    // Main outlines (more than one board)
    std::vector<TopoDS_Shape> m_board_outlines;
 
    // Copper items. Key is netname.
    std::map<wxString, std::vector<TopoDS_Shape>> m_board_copper;
    std::map<wxString, std::vector<TopoDS_Shape>> m_board_copper_pads;
    std::map<wxString, std::vector<TopoDS_Shape>> m_board_copper_vias;
    std::map<wxString, std::vector<TopoDS_Shape>> m_board_copper_fused;
 
    // Graphical items
    std::vector<TopoDS_Shape> m_board_silkscreen;
    std::vector<TopoDS_Shape> m_board_soldermask;
 
    // Data for pads. Key example: Pad_F_U2_1_GND
    std::map<wxString, std::vector<std::pair<gp_Pnt, TopoDS_Shape>>> m_pad_points;
 
    wxString m_pcbName;
 
    OUTPUT_FORMAT m_outFmt;
    REPORTER*     m_reporter;
};
 
#endif // OCE_VIS_OCE_UTILS_H