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    KiCad PCB EDA Suite
    
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#include <future>#include <core/kicad_algo.h>#include <advanced_config.h>#include <board.h>#include <board_design_settings.h>#include <zone.h>#include <footprint.h>#include <pad.h>#include <pcb_target.h>#include <pcb_track.h>#include <pcb_text.h>#include <pcb_textbox.h>#include <pcb_tablecell.h>#include <pcb_table.h>#include <pcb_dimension.h>#include <connectivity/connectivity_data.h>#include <convert_basic_shapes_to_polygon.h>#include <board_commit.h>#include <progress_reporter.h>#include <geometry/shape_poly_set.h>#include <geometry/convex_hull.h>#include <geometry/geometry_utils.h>#include <geometry/vertex_set.h>#include <kidialog.h>#include <thread_pool.h>#include <math/util.h>#include "zone_filler.h"#include "project.h"#include "project/project_local_settings.h"#include "pcb_barcode.h"Go to the source code of this file.
Classes | |
| class | RESULTS | 
| class | VERTEX_CONNECTOR | 
Macros | |
| #define | DUMP_POLYS_TO_COPPER_LAYER(a, b, c) | 
| #define | SMOOTH_MIN_VAL_MM 0.02 | 
| #define | SMOOTH_SMALL_VAL_MM 0.04 | 
Functions | |
| int | getHatchFillThermalClearance (const ZONE *aZone, BOARD_ITEM *aItem, PCB_LAYER_ID aLayer) | 
| #define DUMP_POLYS_TO_COPPER_LAYER | ( | a, | |
| b, | |||
| c ) | 
Definition at line 1760 of file zone_filler.cpp.
Referenced by ZONE_FILLER::addHatchFillTypeOnZone(), and ZONE_FILLER::fillCopperZone().
| #define SMOOTH_MIN_VAL_MM 0.02 | 
Referenced by ZONE_FILLER::addHatchFillTypeOnZone().
| #define SMOOTH_SMALL_VAL_MM 0.04 | 
Referenced by ZONE_FILLER::addHatchFillTypeOnZone().
| int getHatchFillThermalClearance | ( | const ZONE * | aZone, | 
| BOARD_ITEM * | aItem, | ||
| PCB_LAYER_ID | aLayer ) | 
Definition at line 990 of file zone_filler.cpp.
References ZONE::GetHatchGap(), ZONE::GetHatchThickness(), pad, PCB_PAD_T, PCB_VIA_T, EDA_ITEM::Type(), via, VECTOR2< T >::x, and VECTOR2< T >::y.
Referenced by ZONE_FILLER::buildThermalSpokes(), and ZONE_FILLER::knockoutThermalReliefs().