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KiCad PCB EDA Suite
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#include <qa_utils/wx_utils/unit_test_utils.h>#include <pcbnew_utils/board_test_utils.h>#include <board.h>#include <board_commit.h>#include <board_design_settings.h>#include <footprint.h>#include <pad.h>#include <zone.h>#include <settings/settings_manager.h>#include <geometry/shape_poly_set.h>#include <teardrop/teardrop.h>#include <tool/tool_manager.h>Go to the source code of this file.
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| BOOST_AUTO_TEST_CASE (NoTeardropOnZoneConnectedThermalPad) | |
| The U2 corner of demos/royalblue54L_feather. | |
| BOOST_AUTO_TEST_CASE | ( | NoTeardropOnZoneConnectedThermalPad | ) |
The U2 corner of demos/royalblue54L_feather.
The QFN's 3.6 mm exposed pad is held by the GND pour through thermal spokes so it wants no teardrop, but its centre falls in the thermal gap punched for the via underneath it, where the fill reads as absent.
Definition at line 44 of file test_teardrop_shorts.cpp.
References SHAPE_POLY_SET::BooleanIntersection(), BOOST_CHECK_EQUAL(), BOOST_REQUIRE(), COMMIT::Empty(), ERROR_INSIDE, F_Cu, KI_TEST::FillZones(), SHAPE_POLY_SET::IsEmpty(), KI_TEST::LoadBoard(), SHAPE_POLY_SET::Outline(), pad, pcbIUScale, BOARD_COMMIT::Push(), TOOL_MANAGER::RegisterTool(), TOOL_MANAGER::SetEnvironment(), SKIP_SET_DIRTY, SKIP_UNDO, PAD::TransformShapeToPolygon(), and TEARDROP_MANAGER::UpdateTeardrops().