TRACK_VIA_DESC Struct Reference

Public Member Functions
	TRACK_VIA_DESC ()

Detailed Description

Definition at line 2838 of file pcb_track.cpp.

Constructor & Destructor Documentation

TRACK_VIA_DESC()

TRACK_VIA_DESC::TRACK_VIA_DESC ( )

inline

Definition at line 2840 of file pcb_track.cpp.

References _HKI, ORIGIN_TRANSFORMS::ABS_X_COORD, ORIGIN_TRANSFORMS::ABS_Y_COORD, PROPERTY_MANAGER::AddProperty(), LSET::AllLayersMask(), BACKDRILL_BOTH, BACKDRILL_BOTTOM, BACKDRILL_TOP, BLIND, PCB_VIA::BottomLayer(), BURIED, CAPPED, ENUM_MAP< T >::Choices(), COUNTERBORE, COUNTERSINK, COVERED, FILLED, FROM_BOARD, PCB_VIA::GetBackCoveringMode(), PCB_VIA::GetBackdrillMode(), PCB_VIA::GetBackPluggingMode(), PCB_VIA::GetBackPostMachiningAngle(), PCB_VIA::GetBackPostMachiningDepth(), PCB_VIA::GetBackPostMachiningMode(), PCB_VIA::GetBackPostMachiningSize(), PCB_VIA::GetBackTentingMode(), PCB_VIA::GetBottomBackdrillLayer(), PCB_VIA::GetBottomBackdrillSize(), PCB_VIA::GetCappingMode(), PCB_VIA::GetDrillValue(), PCB_TRACK::GetEndX(), PCB_TRACK::GetEndY(), PCB_VIA::GetFillingMode(), PCB_VIA::GetFrontCoveringMode(), PCB_VIA::GetFrontPluggingMode(), PCB_VIA::GetFrontPostMachiningAngle(), PCB_VIA::GetFrontPostMachiningDepth(), PCB_VIA::GetFrontPostMachiningMode(), PCB_VIA::GetFrontPostMachiningSize(), PCB_VIA::GetFrontTentingMode(), PCB_VIA::GetFrontWidth(), PCB_VIA::GetLayer(), PCB_TRACK::GetLocalSolderMaskMargin(), PCB_TRACK::GetStartX(), PCB_TRACK::GetStartY(), PCB_VIA::GetTopBackdrillLayer(), PCB_VIA::GetTopBackdrillSize(), PCB_VIA::GetViaType(), PCB_TRACK::GetWidth(), PCB_TRACK::HasSolderMask(), PROPERTY_MANAGER::InheritsAfter(), ENUM_MAP< T >::Instance(), PROPERTY_MANAGER::Instance(), IsExternalCopperLayer(), ENUM_MAP< T >::Map(), PROPERTY_MANAGER::Mask(), MICROVIA, LSET::Name(), NO_BACKDRILL, NOT_CAPPED, NOT_COVERED, NOT_DEFINED, NOT_FILLED, NOT_PLUGGED, NOT_TENTED, PCB_VIA_T, PLUGGED, PT_COORD, PT_DECIDEGREE, PT_SIZE, REGISTER_TYPE, PROPERTY_MANAGER::ReplaceProperty(), PROPERTY_BASE::SetAvailableFunc(), PCB_VIA::SetBackCoveringMode(), PCB_VIA::SetBackdrillMode(), PCB_VIA::SetBackPluggingMode(), PCB_VIA::SetBackPostMachiningAngle(), PCB_VIA::SetBackPostMachiningDepth(), PCB_VIA::SetBackPostMachiningMode(), PCB_VIA::SetBackPostMachiningSize(), PCB_VIA::SetBackTentingMode(), PCB_VIA::SetBottomBackdrillLayer(), PCB_VIA::SetBottomBackdrillSize(), PCB_VIA::SetBottomLayer(), PCB_VIA::SetCappingMode(), PCB_VIA::SetDrill(), PCB_TRACK::SetEndX(), PCB_TRACK::SetEndY(), PCB_VIA::SetFillingMode(), PCB_VIA::SetFrontCoveringMode(), PCB_VIA::SetFrontPluggingMode(), PCB_VIA::SetFrontPostMachiningAngle(), PCB_VIA::SetFrontPostMachiningDepth(), PCB_VIA::SetFrontPostMachiningMode(), PCB_VIA::SetFrontPostMachiningSize(), PCB_VIA::SetFrontTentingMode(), PCB_VIA::SetFrontWidth(), PCB_TRACK::SetHasSolderMask(), PCB_TRACK::SetLocalSolderMaskMargin(), PCB_TRACK::SetStartX(), PCB_TRACK::SetStartY(), PCB_VIA::SetTopBackdrillLayer(), PCB_VIA::SetTopBackdrillSize(), PCB_VIA::SetTopLayer(), PROPERTY_BASE::SetValidator(), PCB_VIA::SetViaType(), PCB_TRACK::SetWidth(), TENTED, THROUGH, TYPE_HASH, ENUM_MAP< T >::Undefined(), UNDEFINED_LAYER, PCB_VIA::ValidateViaParameters(), and via.

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The documentation for this struct was generated from the following file:

• pcb_track.cpp