|
KiCad PCB EDA Suite
|
! The properties of a padstack drill. Drill position is always the pad position (origin). More...
#include <padstack.h>
Public Member Functions | |
| bool | operator== (const DRILL_PROPS &aOther) const |
Public Attributes | |
| VECTOR2I | size |
| Drill diameter (x == y) or slot dimensions (x != y) | |
| PAD_DRILL_SHAPE | shape |
| PCB_LAYER_ID | start |
| PCB_LAYER_ID | end |
| std::optional< bool > | is_filled |
| True if the drill hole should be filled completely. | |
| std::optional< bool > | is_capped |
| True if the drill hole should be capped. | |
! The properties of a padstack drill. Drill position is always the pad position (origin).
Definition at line 260 of file padstack.h.
| bool PADSTACK::DRILL_PROPS::operator== | ( | const DRILL_PROPS & | aOther | ) | const |
| PCB_LAYER_ID PADSTACK::DRILL_PROPS::end |
Definition at line 265 of file padstack.h.
Referenced by ODB_MATRIX_ENTITY::AddDrillMatrixLayer(), PCB_VIA::BottomLayer(), ZONE_FILLER::buildCopperItemClearances(), EXPORTER_STEP::buildFootprint3DShapes(), GENDRILL_WRITER_BASE::buildHolesList(), EXPORTER_STEP::buildTrack3DShape(), PADSTACK::Deserialize(), PCB_IO_IPC2581::ensureBackdrillSpecs(), ZONE_FILLER::Fill(), PCB_VIA::FlashLayer(), PCB_IO_KICAD_SEXPR::format(), PAD::GetEffectiveShape(), PCB_VIA::GetEffectiveShape(), GENDRILL_WRITER_BASE::getUniqueLayerPairs(), DIALOG_PAD_PROPERTIES::initValues(), PAD::IsBackdrilledOrPostMachined(), PCB_VIA::IsBackdrilledOrPostMachined(), PCB_VIA::IsBlindVia(), PCB_VIA::IsBuriedVia(), PCB_VIA::IsOnLayer(), ZONE_FILLER::knockoutThermalReliefs(), PCB_VIA::LayerPair(), operator==(), PCB_IO_KICAD_SEXPR_PARSER::parsePAD(), PCB_IO_KICAD_SEXPR_PARSER::parsePCB_VIA(), PCB_VIA::PCB_VIA(), PCB_VIA::SanitizeLayers(), PADSTACK::SetBackdrillEndLayer(), PADSTACK::SetBackdrillMode(), PADSTACK::SetBackdrillSize(), PCB_VIA::SetBottomLayer(), PCB_VIA::SetLayerPair(), PCB_VIA::SetLayerSet(), DIALOG_TRACK_VIA_PROPERTIES::TransferDataFromWindow(), DIALOG_PAD_PROPERTIES::transferDataToPad(), and DIALOG_TRACK_VIA_PROPERTIES::TransferDataToWindow().
| std::optional<bool> PADSTACK::DRILL_PROPS::is_capped |
True if the drill hole should be capped.
Definition at line 268 of file padstack.h.
Referenced by GENDRILL_WRITER_BASE::buildHolesList(), PADSTACK::Deserialize(), PCB_IO_KICAD_SEXPR::format(), VIA_PROTECTION_UI_MIXIN::getViaConfiguration(), operator==(), and VIA_PROTECTION_UI_MIXIN::setViaConfiguration().
| std::optional<bool> PADSTACK::DRILL_PROPS::is_filled |
True if the drill hole should be filled completely.
Definition at line 267 of file padstack.h.
Referenced by GENDRILL_WRITER_BASE::buildHolesList(), PADSTACK::Deserialize(), PCB_IO_KICAD_SEXPR::format(), VIA_PROTECTION_UI_MIXIN::getViaConfiguration(), operator==(), and VIA_PROTECTION_UI_MIXIN::setViaConfiguration().
| PAD_DRILL_SHAPE PADSTACK::DRILL_PROPS::shape |
Definition at line 263 of file padstack.h.
Referenced by GENDRILL_WRITER_BASE::buildHolesList(), PADSTACK::Deserialize(), operator==(), PADSTACK::SetBackdrillMode(), PADSTACK::SetBackdrillSize(), DIALOG_TRACK_VIA_PROPERTIES::TransferDataFromWindow(), and DIALOG_PAD_PROPERTIES::transferDataToPad().
| VECTOR2I PADSTACK::DRILL_PROPS::size |
Drill diameter (x == y) or slot dimensions (x != y)
Definition at line 262 of file padstack.h.
Referenced by ODB_MATRIX_ENTITY::AddDrillMatrixLayer(), ZONE_FILLER::buildCopperItemClearances(), EXPORTER_STEP::buildFootprint3DShapes(), GENDRILL_WRITER_BASE::buildHolesList(), EXPORTER_STEP::buildTrack3DShape(), PADSTACK::Deserialize(), PCB_IO_IPC2581::ensureBackdrillSpecs(), PCB_IO_KICAD_SEXPR::format(), PAD::GetEffectiveShape(), PCB_VIA::GetEffectiveShape(), GENDRILL_WRITER_BASE::getUniqueLayerPairs(), ODB_LAYER_ENTITY::InitDrillData(), DIALOG_PAD_PROPERTIES::initValues(), PAD::IsBackdrilledOrPostMachined(), PCB_VIA::IsBackdrilledOrPostMachined(), ZONE_FILLER::knockoutThermalReliefs(), operator==(), PCB_IO_KICAD_SEXPR_PARSER::parsePAD(), PCB_IO_KICAD_SEXPR_PARSER::parsePCB_VIA(), PADSTACK::SetBackdrillMode(), PADSTACK::SetBackdrillSize(), DIALOG_TRACK_VIA_PROPERTIES::TransferDataFromWindow(), and DIALOG_PAD_PROPERTIES::transferDataToPad().
| PCB_LAYER_ID PADSTACK::DRILL_PROPS::start |
Definition at line 264 of file padstack.h.
Referenced by ODB_MATRIX_ENTITY::AddDrillMatrixLayer(), ZONE_FILLER::buildCopperItemClearances(), EXPORTER_STEP::buildFootprint3DShapes(), GENDRILL_WRITER_BASE::buildHolesList(), EXPORTER_STEP::buildTrack3DShape(), PADSTACK::Deserialize(), PCB_IO_IPC2581::ensureBackdrillSpecs(), ZONE_FILLER::Fill(), PCB_VIA::FlashLayer(), PCB_IO_KICAD_SEXPR::format(), PAD::GetEffectiveShape(), PCB_VIA::GetEffectiveShape(), PCB_VIA::GetLayer(), GENDRILL_WRITER_BASE::getUniqueLayerPairs(), DIALOG_PAD_PROPERTIES::initValues(), PAD::IsBackdrilledOrPostMachined(), PCB_VIA::IsBackdrilledOrPostMachined(), PCB_VIA::IsBlindVia(), PCB_VIA::IsBuriedVia(), PCB_VIA::IsOnLayer(), ZONE_FILLER::knockoutThermalReliefs(), PCB_VIA::LayerPair(), operator==(), PCB_IO_KICAD_SEXPR_PARSER::parsePAD(), PCB_IO_KICAD_SEXPR_PARSER::parsePCB_VIA(), PCB_VIA::PCB_VIA(), PCB_VIA::SanitizeLayers(), PADSTACK::SetBackdrillMode(), PADSTACK::SetBackdrillSize(), PCB_VIA::SetLayer(), PCB_VIA::SetLayerPair(), PCB_VIA::SetLayerSet(), PCB_VIA::SetTopLayer(), PCB_VIA::TopLayer(), DIALOG_TRACK_VIA_PROPERTIES::TransferDataFromWindow(), DIALOG_PAD_PROPERTIES::transferDataToPad(), and DIALOG_TRACK_VIA_PROPERTIES::TransferDataToWindow().