60 wxASSERT( footprint && aIndexInFootprint < footprint->Pads().size()
61 && footprint->
Pads()[aIndexInFootprint] == &aPad );
65 pin.m_name = wxString::Format(
"NPTH%zu", aIndexInFootprint );
69 pin.m_name = wxString::Format(
"PAD%zu", aIndexInFootprint );
FOOTPRINT * GetParentFootprint() const
PAD_PROP GetProperty() const
PAD_ATTRIB GetAttribute() const
const wxString & GetNumber() const
bool IsOnCopperLayer() const override
bool HasHole() const override
FAB_PAD_ROLE GetFabPadRole(const PAD &aPad)
Explicit fabrication properties take precedence over the unnumbered NPTH fallback.
FAB_PIN MakeFabPin(const PAD &aPad, size_t aIndexInFootprint)
aIndexInFootprint is the pad's position in its footprint, used to name NPTH and unnumbered pads
@ NPTH
like PAD_PTH, but not plated mechanical use only, no connection allowed
@ SMD
Smd pad, appears on the solder paste layer (default)
@ PTH
Plated through hole pad.
@ FIDUCIAL_LOCAL
a fiducial (usually a smd) local to the parent footprint
@ FIDUCIAL_GLBL
a fiducial (usually a smd) for the full board
@ MECHANICAL
a pad used for mechanical support
@ PRESSFIT
a PTH with a hole diameter with tight tolerances for press fit pin
@ HEATSINK
a pad used as heat sink, usually in SMD footprints
@ NONE
no special fabrication property
@ TESTPOINT
a test point pad
@ CASTELLATED
a pad with a castellated through hole
@ BGA
Smd pad, used in BGA footprints.