KiCad PCB EDA Suite
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subset of eagle.drawing.board.designrules in the XML document More...
#include <pcb_io_eagle.h>
Public Member Functions | |
ERULES () | |
void | parse (wxXmlNode *aRules, std::function< void()> aCheckpoint) |
percent over 100%. | |
Public Attributes | |
int | psElongationLong |
int | psElongationOffset |
the offset of the hole within the "long" pad. | |
double | mvStopFrame |
solderpaste mask, expressed as percentage of the smaller pad/via dimension | |
double | mvCreamFrame |
int | mlMinStopFrame |
solder mask, minimum size (Eagle mils, here nanometers) | |
int | mlMaxStopFrame |
solder mask, maximum size (Eagle mils, here nanometers) | |
int | mlMinCreamFrame |
solder paste mask, minimum size (Eagle mils, here nanometers) | |
int | mlMaxCreamFrame |
solder paste mask, maximum size (Eagle mils, here nanometers) | |
int | psTop |
Shape of the top pads. | |
int | psBottom |
Shape of the bottom pads. | |
int | psFirst |
Shape of the first pads. | |
double | srRoundness |
corner rounding ratio for SMD pads (percentage) | |
int | srMinRoundness |
corner rounding radius, maximum size (Eagle mils, here nanometers) | |
int | srMaxRoundness |
double | rvPadTop |
top pad size as percent of drill size | |
double | rlMinPadTop |
minimum copper annulus on through hole pads | |
double | rlMaxPadTop |
maximum copper annulus on through hole pads | |
double | rvViaOuter |
copper annulus is this percent of via hole | |
double | rlMinViaOuter |
minimum copper annulus on via | |
double | rlMaxViaOuter |
maximum copper annulus on via | |
double | mdWireWire |
wire to wire spacing I presume. | |
subset of eagle.drawing.board.designrules in the XML document
Definition at line 53 of file pcb_io_eagle.h.
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inline |
Definition at line 55 of file pcb_io_eagle.h.
void ERULES::parse | ( | wxXmlNode * | aRules, |
std::function< void()> | aCheckpoint | ||
) |
percent over 100%.
0-> not elongated, 100->twice as wide as is tall Goes into making a scaling factor for "long" pads.
Definition at line 163 of file pcb_io_eagle.cpp.
References mdWireWire, mlMaxCreamFrame, mlMaxStopFrame, mlMinCreamFrame, mlMinStopFrame, mvCreamFrame, mvStopFrame, name, parseEagle(), psBottom, psElongationLong, psElongationOffset, psFirst, psTop, rlMaxPadTop, rlMaxViaOuter, rlMinPadTop, rlMinViaOuter, rvPadTop, rvViaOuter, srMaxRoundness, srMinRoundness, and srRoundness.
Referenced by PCB_IO_EAGLE::loadDesignRules().
double ERULES::mdWireWire |
wire to wire spacing I presume.
Definition at line 124 of file pcb_io_eagle.h.
Referenced by PCB_IO_EAGLE::LoadBoard(), and parse().
int ERULES::mlMaxCreamFrame |
solder paste mask, maximum size (Eagle mils, here nanometers)
Definition at line 101 of file pcb_io_eagle.h.
Referenced by parse().
int ERULES::mlMaxStopFrame |
solder mask, maximum size (Eagle mils, here nanometers)
Definition at line 99 of file pcb_io_eagle.h.
Referenced by parse().
int ERULES::mlMinCreamFrame |
solder paste mask, minimum size (Eagle mils, here nanometers)
Definition at line 100 of file pcb_io_eagle.h.
Referenced by parse().
int ERULES::mlMinStopFrame |
solder mask, minimum size (Eagle mils, here nanometers)
Definition at line 98 of file pcb_io_eagle.h.
Referenced by parse().
double ERULES::mvCreamFrame |
Definition at line 97 of file pcb_io_eagle.h.
Referenced by parse().
double ERULES::mvStopFrame |
solderpaste mask, expressed as percentage of the smaller pad/via dimension
Definition at line 94 of file pcb_io_eagle.h.
Referenced by parse().
int ERULES::psBottom |
int ERULES::psElongationLong |
Definition at line 89 of file pcb_io_eagle.h.
Referenced by parse().
int ERULES::psElongationOffset |
the offset of the hole within the "long" pad.
solder mask, expressed as percentage of the smaller pad/via dimension
Definition at line 91 of file pcb_io_eagle.h.
Referenced by parse().
int ERULES::psFirst |
int ERULES::psTop |
double ERULES::rlMaxPadTop |
maximum copper annulus on through hole pads
Definition at line 119 of file pcb_io_eagle.h.
Referenced by parse().
double ERULES::rlMaxViaOuter |
double ERULES::rlMinPadTop |
minimum copper annulus on through hole pads
Definition at line 118 of file pcb_io_eagle.h.
Referenced by parse().
double ERULES::rlMinViaOuter |
double ERULES::rvPadTop |
top pad size as percent of drill size
Definition at line 115 of file pcb_io_eagle.h.
Referenced by parse().
double ERULES::rvViaOuter |
copper annulus is this percent of via hole
Definition at line 121 of file pcb_io_eagle.h.
Referenced by parse().
int ERULES::srMaxRoundness |
Definition at line 113 of file pcb_io_eagle.h.
Referenced by parse().
int ERULES::srMinRoundness |
corner rounding radius, maximum size (Eagle mils, here nanometers)
Definition at line 110 of file pcb_io_eagle.h.
Referenced by parse().
double ERULES::srRoundness |
corner rounding ratio for SMD pads (percentage)
corner rounding radius, minimum size (Eagle mils, here nanometers)
Definition at line 107 of file pcb_io_eagle.h.
Referenced by parse().