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    KiCad PCB EDA Suite
    
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subset of eagle.drawing.board.designrules in the XML document More...
#include <pcb_io_eagle.h>
Public Member Functions | |
| ERULES () | |
| void | parse (wxXmlNode *aRules, std::function< void()> aCheckpoint) | 
| percent over 100%.   | |
Public Attributes | |
| int | psElongationLong | 
| int | psElongationOffset | 
| the offset of the hole within the "long" pad.   | |
| double | mvStopFrame | 
| solderpaste mask, expressed as percentage of the smaller pad/via dimension   | |
| double | mvCreamFrame | 
| int | mlMinStopFrame | 
| solder mask, minimum size (Eagle mils, here nanometers)   | |
| int | mlMaxStopFrame | 
| solder mask, maximum size (Eagle mils, here nanometers)   | |
| int | mlMinCreamFrame | 
| solder paste mask, minimum size (Eagle mils, here nanometers)   | |
| int | mlMaxCreamFrame | 
| solder paste mask, maximum size (Eagle mils, here nanometers)   | |
| int | psTop | 
| Shape of the top pads.   | |
| int | psBottom | 
| Shape of the bottom pads.   | |
| int | psFirst | 
| Shape of the first pads.   | |
| double | srRoundness | 
| corner rounding ratio for SMD pads (percentage)   | |
| int | srMinRoundness | 
| corner rounding radius, maximum size (Eagle mils, here nanometers)   | |
| int | srMaxRoundness | 
| double | rvPadTop | 
| top pad size as percent of drill size   | |
| double | rlMinPadTop | 
| minimum copper annulus on through hole pads   | |
| double | rlMaxPadTop | 
| maximum copper annulus on through hole pads   | |
| double | rvViaOuter | 
| copper annulus is this percent of via hole   | |
| double | rlMinViaOuter | 
| minimum copper annulus on via   | |
| double | rlMaxViaOuter | 
| maximum copper annulus on via   | |
| double | mdWireWire | 
| wire to wire spacing I presume.   | |
subset of eagle.drawing.board.designrules in the XML document
Definition at line 53 of file pcb_io_eagle.h.
      
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  inline | 
Definition at line 55 of file pcb_io_eagle.h.
References mdWireWire, mlMaxCreamFrame, mlMaxStopFrame, mlMinCreamFrame, mlMinStopFrame, mvCreamFrame, mvStopFrame, pcbIUScale, psBottom, psElongationLong, psElongationOffset, psFirst, psTop, rlMaxPadTop, rlMaxViaOuter, rlMinPadTop, rlMinViaOuter, rvPadTop, rvViaOuter, srMaxRoundness, srMinRoundness, and srRoundness.
| void ERULES::parse | ( | wxXmlNode * | aRules, | 
| std::function< void()> | aCheckpoint ) | 
percent over 100%.
0-> not elongated, 100->twice as wide as is tall Goes into making a scaling factor for "long" pads.
Definition at line 162 of file pcb_io_eagle.cpp.
References mdWireWire, mlMaxCreamFrame, mlMaxStopFrame, mlMinCreamFrame, mlMinStopFrame, mvCreamFrame, mvStopFrame, name, parseEagle(), psBottom, psElongationLong, psElongationOffset, psFirst, psTop, rlMaxPadTop, rlMaxViaOuter, rlMinPadTop, rlMinViaOuter, rvPadTop, rvViaOuter, srMaxRoundness, srMinRoundness, and srRoundness.
| double ERULES::mdWireWire | 
wire to wire spacing I presume.
Definition at line 124 of file pcb_io_eagle.h.
| int ERULES::mlMaxCreamFrame | 
solder paste mask, maximum size (Eagle mils, here nanometers)
Definition at line 101 of file pcb_io_eagle.h.
| int ERULES::mlMaxStopFrame | 
solder mask, maximum size (Eagle mils, here nanometers)
Definition at line 99 of file pcb_io_eagle.h.
| int ERULES::mlMinCreamFrame | 
solder paste mask, minimum size (Eagle mils, here nanometers)
Definition at line 100 of file pcb_io_eagle.h.
| int ERULES::mlMinStopFrame | 
solder mask, minimum size (Eagle mils, here nanometers)
Definition at line 98 of file pcb_io_eagle.h.
| double ERULES::mvCreamFrame | 
Definition at line 97 of file pcb_io_eagle.h.
| double ERULES::mvStopFrame | 
solderpaste mask, expressed as percentage of the smaller pad/via dimension
Definition at line 94 of file pcb_io_eagle.h.
| int ERULES::psBottom | 
Shape of the bottom pads.
Definition at line 104 of file pcb_io_eagle.h.
| int ERULES::psElongationLong | 
Definition at line 89 of file pcb_io_eagle.h.
| int ERULES::psElongationOffset | 
the offset of the hole within the "long" pad.
solder mask, expressed as percentage of the smaller pad/via dimension
Definition at line 91 of file pcb_io_eagle.h.
| int ERULES::psFirst | 
Shape of the first pads.
Definition at line 105 of file pcb_io_eagle.h.
| int ERULES::psTop | 
Shape of the top pads.
Definition at line 103 of file pcb_io_eagle.h.
| double ERULES::rlMaxPadTop | 
maximum copper annulus on through hole pads
Definition at line 119 of file pcb_io_eagle.h.
| double ERULES::rlMaxViaOuter | 
maximum copper annulus on via
Definition at line 123 of file pcb_io_eagle.h.
| double ERULES::rlMinPadTop | 
minimum copper annulus on through hole pads
Definition at line 118 of file pcb_io_eagle.h.
| double ERULES::rlMinViaOuter | 
minimum copper annulus on via
Definition at line 122 of file pcb_io_eagle.h.
| double ERULES::rvPadTop | 
top pad size as percent of drill size
Definition at line 115 of file pcb_io_eagle.h.
| double ERULES::rvViaOuter | 
copper annulus is this percent of via hole
Definition at line 121 of file pcb_io_eagle.h.
| int ERULES::srMaxRoundness | 
Definition at line 113 of file pcb_io_eagle.h.
| int ERULES::srMinRoundness | 
corner rounding radius, maximum size (Eagle mils, here nanometers)
Definition at line 110 of file pcb_io_eagle.h.
| double ERULES::srRoundness | 
corner rounding ratio for SMD pads (percentage)
corner rounding radius, minimum size (Eagle mils, here nanometers)
Definition at line 107 of file pcb_io_eagle.h.