KiCad PCB EDA Suite
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#include <cadstar_pcb_archive_parser.h>
Public Types | |
enum class | COPPER_FILL_TYPE { FILLED , HATCHED } |
enum class | RELIEF_TYPE { CROSS , CUTOUTS } |
From CADSTAR Help: "With this parameter you can select one of two ways in which to generate thermal reliefs. More... | |
Public Member Functions | |
void | Parse (XNODE *aNode, PARSER_CONTEXT *aContext) override |
Public Attributes | |
COPPERCODE_ID | CopperCodeID |
From CADSTAR Help: "Copper Code is for selecting the width of the line used to draw the outline and filling for the copper shape. | |
COPPERCODE_ID | ReliefCopperCodeID |
From CADSTAR Help: "Relief Copper Code is for
selecting the width of line used to draw the
thermal reliefs for pads connected to the
power planes (created by Copper Pour) This
subsequently controls the pen width (or
aperture etc ...) used on a plotting machine" (param1) | |
long | ClearanceWidth |
Specifies the space around pads when pouring (i.e. | |
long | SliverWidth |
Minimum width of copper that may be created. | |
long | AdditionalIsolation |
This is the gap to apply in routes and pads in addition to the existing pad-to-copper or route-to-copper spacing (see SPACINGCODE.ID) | |
long | ThermalReliefPadsAngle |
Orientation for the thermal reliefs. | |
long | ThermalReliefViasAngle |
Disabled when !ThermalReliefOnVias (param6) | |
long | MinIsolatedCopper = UNDEFINED_VALUE |
The value is the length of one side of a notional square. | |
long | MinDisjointCopper = UNDEFINED_VALUE |
The value is the length of one side of a notional square. | |
bool | ThermalReliefOnPads = true |
false when subnode "NOPINRELIEF" is present | |
bool | ThermalReliefOnVias = true |
false when subnode "NOVIARELIEF" is present | |
bool | AllowInNoRouting = false |
true when subnode "IGNORETRN" is present | |
bool | BoxIsolatedPins = false |
true when subnode "BOXPINS" is present | |
bool | AutomaticRepour = false |
true when subnode "REGENERATE" is present | |
bool | TargetForAutorouting = false |
true when subnode "AUTOROUTETARGET" is present | |
RELIEF_TYPE | ReliefType = RELIEF_TYPE::CROSS |
See RELIEF_TYPE. | |
COPPER_FILL_TYPE | FillType = COPPER_FILL_TYPE::FILLED |
Assume solid fill. | |
HATCHCODE_ID | HatchCodeID = wxEmptyString |
Only for FillType = HATCHED. | |
Definition at line 1045 of file cadstar_pcb_archive_parser.h.
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strong |
Enumerator | |
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FILLED | |
HATCHED | This is a user defined HATCHCODE_ID. |
Definition at line 1047 of file cadstar_pcb_archive_parser.h.
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strong |
From CADSTAR Help: "With this parameter you can select one of two ways in which to generate thermal reliefs.
" Note: there doesn't appear to be any noticeable difference between the options.
Definition at line 1058 of file cadstar_pcb_archive_parser.h.
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overridevirtual |
Implements CADSTAR_ARCHIVE_PARSER::PARSER.
Definition at line 2210 of file cadstar_pcb_archive_parser.cpp.
References XNODE::GetChildren(), XNODE::GetNext(), CADSTAR_ARCHIVE_PARSER::GetXmlAttributeIDLong(), CADSTAR_ARCHIVE_PARSER::GetXmlAttributeIDString(), THROW_UNKNOWN_NODE_IO_ERROR, and CADSTAR_ARCHIVE_PARSER::UNDEFINED_VALUE.
long CADSTAR_PCB_ARCHIVE_PARSER::TEMPLATE::POURING::AdditionalIsolation |
This is the gap to apply in routes and pads in addition to the existing pad-to-copper or route-to-copper spacing (see SPACINGCODE.ID)
Definition at line 1084 of file cadstar_pcb_archive_parser.h.
Referenced by CADSTAR_PCB_ARCHIVE_LOADER::loadTemplates().
bool CADSTAR_PCB_ARCHIVE_PARSER::TEMPLATE::POURING::AllowInNoRouting = false |
true when subnode "IGNORETRN" is present
Definition at line 1099 of file cadstar_pcb_archive_parser.h.
Referenced by CADSTAR_PCB_ARCHIVE_LOADER::loadTemplates().
bool CADSTAR_PCB_ARCHIVE_PARSER::TEMPLATE::POURING::AutomaticRepour = false |
true when subnode "REGENERATE" is present
Definition at line 1101 of file cadstar_pcb_archive_parser.h.
Referenced by CADSTAR_PCB_ARCHIVE_LOADER::loadTemplates().
bool CADSTAR_PCB_ARCHIVE_PARSER::TEMPLATE::POURING::BoxIsolatedPins = false |
true when subnode "BOXPINS" is present
Definition at line 1100 of file cadstar_pcb_archive_parser.h.
Referenced by CADSTAR_PCB_ARCHIVE_LOADER::loadTemplates().
long CADSTAR_PCB_ARCHIVE_PARSER::TEMPLATE::POURING::ClearanceWidth |
Specifies the space around pads when pouring (i.e.
Thermal relief clearance)
Definition at line 1081 of file cadstar_pcb_archive_parser.h.
Referenced by CADSTAR_PCB_ARCHIVE_LOADER::loadTemplates().
COPPERCODE_ID CADSTAR_PCB_ARCHIVE_PARSER::TEMPLATE::POURING::CopperCodeID |
From CADSTAR Help: "Copper Code is for selecting the width of the line used to draw the outline and filling for the copper shape.
This subsequently controls the pen width (or aperture etc ...) used on a plotting machine." (param0)
Definition at line 1067 of file cadstar_pcb_archive_parser.h.
Referenced by CADSTAR_PCB_ARCHIVE_LOADER::loadTemplates().
COPPER_FILL_TYPE CADSTAR_PCB_ARCHIVE_PARSER::TEMPLATE::POURING::FillType = COPPER_FILL_TYPE::FILLED |
Assume solid fill.
Definition at line 1105 of file cadstar_pcb_archive_parser.h.
Referenced by CADSTAR_PCB_ARCHIVE_LOADER::loadTemplates().
HATCHCODE_ID CADSTAR_PCB_ARCHIVE_PARSER::TEMPLATE::POURING::HatchCodeID = wxEmptyString |
Only for FillType = HATCHED.
Definition at line 1106 of file cadstar_pcb_archive_parser.h.
Referenced by CADSTAR_PCB_ARCHIVE_LOADER::loadTemplates().
long CADSTAR_PCB_ARCHIVE_PARSER::TEMPLATE::POURING::MinDisjointCopper = UNDEFINED_VALUE |
The value is the length of one side of a notional square.
Disabled when UNDEFINED_VALUE
Definition at line 1093 of file cadstar_pcb_archive_parser.h.
Referenced by CADSTAR_PCB_ARCHIVE_LOADER::loadTemplates().
long CADSTAR_PCB_ARCHIVE_PARSER::TEMPLATE::POURING::MinIsolatedCopper = UNDEFINED_VALUE |
The value is the length of one side of a notional square.
Disabled when UNDEFINED_VALUE
Definition at line 1090 of file cadstar_pcb_archive_parser.h.
Referenced by CADSTAR_PCB_ARCHIVE_LOADER::loadTemplates().
COPPERCODE_ID CADSTAR_PCB_ARCHIVE_PARSER::TEMPLATE::POURING::ReliefCopperCodeID |
From CADSTAR Help: "Relief Copper Code is for selecting the width of line used to draw the thermal reliefs for pads connected to the power planes (created by Copper Pour) This subsequently controls the pen width (or aperture etc ...) used on a plotting machine" (param1)
Definition at line 1073 of file cadstar_pcb_archive_parser.h.
Referenced by CADSTAR_PCB_ARCHIVE_LOADER::loadTemplates().
RELIEF_TYPE CADSTAR_PCB_ARCHIVE_PARSER::TEMPLATE::POURING::ReliefType = RELIEF_TYPE::CROSS |
See RELIEF_TYPE.
Definition at line 1104 of file cadstar_pcb_archive_parser.h.
long CADSTAR_PCB_ARCHIVE_PARSER::TEMPLATE::POURING::SliverWidth |
Minimum width of copper that may be created.
Definition at line 1083 of file cadstar_pcb_archive_parser.h.
Referenced by CADSTAR_PCB_ARCHIVE_LOADER::loadTemplates().
bool CADSTAR_PCB_ARCHIVE_PARSER::TEMPLATE::POURING::TargetForAutorouting = false |
true when subnode "AUTOROUTETARGET" is present
Definition at line 1102 of file cadstar_pcb_archive_parser.h.
bool CADSTAR_PCB_ARCHIVE_PARSER::TEMPLATE::POURING::ThermalReliefOnPads = true |
false when subnode "NOPINRELIEF" is present
Definition at line 1097 of file cadstar_pcb_archive_parser.h.
Referenced by CADSTAR_PCB_ARCHIVE_LOADER::loadTemplates().
bool CADSTAR_PCB_ARCHIVE_PARSER::TEMPLATE::POURING::ThermalReliefOnVias = true |
false when subnode "NOVIARELIEF" is present
Definition at line 1098 of file cadstar_pcb_archive_parser.h.
Referenced by CADSTAR_PCB_ARCHIVE_LOADER::loadTemplates().
long CADSTAR_PCB_ARCHIVE_PARSER::TEMPLATE::POURING::ThermalReliefPadsAngle |
Orientation for the thermal reliefs.
Disabled when !ThermalReliefOnPads (param5)
Definition at line 1087 of file cadstar_pcb_archive_parser.h.
Referenced by CADSTAR_PCB_ARCHIVE_LOADER::loadTemplates().
long CADSTAR_PCB_ARCHIVE_PARSER::TEMPLATE::POURING::ThermalReliefViasAngle |
Disabled when !ThermalReliefOnVias (param6)
Definition at line 1089 of file cadstar_pcb_archive_parser.h.
Referenced by CADSTAR_PCB_ARCHIVE_LOADER::loadTemplates().