KiCad PCB EDA Suite
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Public Attributes | List of all members
PADS_IO::PAD_STACK_LAYER Struct Reference

#include <pads_parser.h>

Public Attributes

int layer = 0
 
std::string shape
 R, S, A, O, OF, RF, RT, ST, RA, SA, RC, OC.
 
double sizeA = 0.0
 Diameter or width.
 
double sizeB = 0.0
 Height for rectangles/ovals.
 
double offsetX = 0.0
 
double offsetY = 0.0
 
double rotation = 0.0
 
double drill = 0.0
 0 for SMD
 
bool plated = true
 PTH vs NPTH.
 
double inner_diameter = 0.0
 Annular ring, 0 = solid.
 
double corner_radius = 0.0
 Always positive.
 
bool chamfered = false
 Negative corner value in PADS.
 
double finger_offset = 0.0
 Along orientation axis.
 
double slot_orientation = 0.0
 0-179.999 degrees
 
double slot_length = 0.0
 
double slot_offset = 0.0
 From electrical center.
 
double thermal_spoke_orientation = 0.0
 First spoke.
 
double thermal_outer_diameter = 0.0
 Thermal or void in plane.
 
double thermal_spoke_width = 0.0
 
int thermal_spoke_count = 0
 

Detailed Description

Definition at line 265 of file pads_parser.h.

Member Data Documentation

◆ chamfered

bool PADS_IO::PAD_STACK_LAYER::chamfered = false

Negative corner value in PADS.

Definition at line 278 of file pads_parser.h.

Referenced by PCB_IO_PADS::loadFootprints(), PADS_IO::PARSER::parseSectionPARTDECAL(), and PADS_IO::PARSER::parseSectionVIA().

◆ corner_radius

double PADS_IO::PAD_STACK_LAYER::corner_radius = 0.0

Always positive.

Definition at line 277 of file pads_parser.h.

Referenced by PCB_IO_PADS_BINARY::applyPadShape(), PCB_IO_PADS_BINARY::buildPad(), PCB_IO_PADS::loadFootprints(), PADS_IO::BINARY_PARSER::parsePadStacks(), PADS_IO::PARSER::parseSectionPARTDECAL(), and PADS_IO::PARSER::parseSectionVIA().

◆ drill

double PADS_IO::PAD_STACK_LAYER::drill = 0.0

0 for SMD

Definition at line 274 of file pads_parser.h.

Referenced by PCB_IO_PADS_BINARY::buildPad(), PCB_IO_PADS::loadFootprints(), PADS_IO::BINARY_PARSER::parsePadStacks(), and PADS_IO::PARSER::parseSectionPARTDECAL().

◆ finger_offset

double PADS_IO::PAD_STACK_LAYER::finger_offset = 0.0

Along orientation axis.

Definition at line 279 of file pads_parser.h.

Referenced by PCB_IO_PADS_BINARY::applyPadShape(), PCB_IO_PADS::loadFootprints(), PADS_IO::PARSER::parseSectionPARTDECAL(), and PADS_IO::PARSER::parseSectionVIA().

◆ inner_diameter

double PADS_IO::PAD_STACK_LAYER::inner_diameter = 0.0

Annular ring, 0 = solid.

Definition at line 276 of file pads_parser.h.

Referenced by PADS_IO::PARSER::parseSectionPARTDECAL(), and PADS_IO::PARSER::parseSectionVIA().

◆ layer

int PADS_IO::PAD_STACK_LAYER::layer = 0

Definition at line 267 of file pads_parser.h.

Referenced by PCB_IO_PADS::loadFootprints(), PCB_IO_PADS::loadTestPoints(), PCB_IO_PADS_BINARY::loadTracksAndVias(), PADS_IO::BINARY_PARSER::parsePadStacks(), PADS_IO::PARSER::parseSectionPARTDECAL(), and PADS_IO::PARSER::parseSectionVIA().

◆ offsetX

double PADS_IO::PAD_STACK_LAYER::offsetX = 0.0

Definition at line 271 of file pads_parser.h.

◆ offsetY

double PADS_IO::PAD_STACK_LAYER::offsetY = 0.0

Definition at line 272 of file pads_parser.h.

◆ plated

bool PADS_IO::PAD_STACK_LAYER::plated = true

PTH vs NPTH.

Definition at line 275 of file pads_parser.h.

Referenced by PCB_IO_PADS_BINARY::buildPad(), PCB_IO_PADS::loadFootprints(), PADS_IO::BINARY_PARSER::parsePadStacks(), PADS_IO::PARSER::parseSectionPARTDECAL(), and PADS_IO::PARSER::parseSectionVIA().

◆ rotation

double PADS_IO::PAD_STACK_LAYER::rotation = 0.0

Definition at line 273 of file pads_parser.h.

Referenced by PCB_IO_PADS_BINARY::applyPadShape(), PCB_IO_PADS_BINARY::buildPad(), PCB_IO_PADS::loadFootprints(), PADS_IO::BINARY_PARSER::parsePadStacks(), PADS_IO::PARSER::parseSectionPARTDECAL(), and PADS_IO::PARSER::parseSectionVIA().

◆ shape

std::string PADS_IO::PAD_STACK_LAYER::shape

R, S, A, O, OF, RF, RT, ST, RA, SA, RC, OC.

Definition at line 268 of file pads_parser.h.

Referenced by PCB_IO_PADS_BINARY::applyPadShape(), PCB_IO_PADS_BINARY::buildPad(), PADS_IO::IsAntiPadRow(), PADS_IO::IsThermalReliefPadRow(), PCB_IO_PADS::loadFootprints(), PADS_IO::BINARY_PARSER::parsePadStacks(), PADS_IO::PARSER::parseSectionPARTDECAL(), and PADS_IO::PARSER::parseSectionVIA().

◆ sizeA

double PADS_IO::PAD_STACK_LAYER::sizeA = 0.0

Diameter or width.

Definition at line 269 of file pads_parser.h.

Referenced by PCB_IO_PADS_BINARY::applyPadShape(), PCB_IO_PADS_BINARY::buildPad(), PCB_IO_PADS::loadFootprints(), PCB_IO_PADS::loadTestPoints(), PCB_IO_PADS_BINARY::loadTracksAndVias(), PADS_IO::BINARY_PARSER::parsePadStacks(), PADS_IO::PARSER::parseSectionPARTDECAL(), and PADS_IO::PARSER::parseSectionVIA().

◆ sizeB

double PADS_IO::PAD_STACK_LAYER::sizeB = 0.0

Height for rectangles/ovals.

Definition at line 270 of file pads_parser.h.

Referenced by PCB_IO_PADS_BINARY::applyPadShape(), PCB_IO_PADS_BINARY::buildPad(), PCB_IO_PADS::loadFootprints(), PADS_IO::BINARY_PARSER::parsePadStacks(), PADS_IO::PARSER::parseSectionPARTDECAL(), and PADS_IO::PARSER::parseSectionVIA().

◆ slot_length

double PADS_IO::PAD_STACK_LAYER::slot_length = 0.0

Definition at line 282 of file pads_parser.h.

Referenced by PCB_IO_PADS_BINARY::buildPad(), PCB_IO_PADS::loadFootprints(), PADS_IO::BINARY_PARSER::parsePadStacks(), and PADS_IO::PARSER::parseSectionPARTDECAL().

◆ slot_offset

double PADS_IO::PAD_STACK_LAYER::slot_offset = 0.0

From electrical center.

Definition at line 283 of file pads_parser.h.

Referenced by PADS_IO::PARSER::parseSectionPARTDECAL().

◆ slot_orientation

double PADS_IO::PAD_STACK_LAYER::slot_orientation = 0.0

0-179.999 degrees

Definition at line 281 of file pads_parser.h.

Referenced by PCB_IO_PADS_BINARY::buildPad(), PCB_IO_PADS::loadFootprints(), PADS_IO::BINARY_PARSER::parsePadStacks(), and PADS_IO::PARSER::parseSectionPARTDECAL().

◆ thermal_outer_diameter

double PADS_IO::PAD_STACK_LAYER::thermal_outer_diameter = 0.0

Thermal or void in plane.

Definition at line 287 of file pads_parser.h.

Referenced by PCB_IO_PADS::loadFootprints(), PADS_IO::BINARY_PARSER::parsePadStacks(), PADS_IO::PARSER::parseSectionPARTDECAL(), and PADS_IO::PARSER::parseSectionVIA().

◆ thermal_spoke_count

int PADS_IO::PAD_STACK_LAYER::thermal_spoke_count = 0

Definition at line 289 of file pads_parser.h.

Referenced by PADS_IO::PARSER::parseSectionPARTDECAL(), and PADS_IO::PARSER::parseSectionVIA().

◆ thermal_spoke_orientation

double PADS_IO::PAD_STACK_LAYER::thermal_spoke_orientation = 0.0

First spoke.

Definition at line 286 of file pads_parser.h.

Referenced by PCB_IO_PADS::loadFootprints(), PADS_IO::PARSER::parseSectionPARTDECAL(), and PADS_IO::PARSER::parseSectionVIA().

◆ thermal_spoke_width

double PADS_IO::PAD_STACK_LAYER::thermal_spoke_width = 0.0

Definition at line 288 of file pads_parser.h.

Referenced by PCB_IO_PADS::loadFootprints(), PADS_IO::PARSER::parseSectionPARTDECAL(), and PADS_IO::PARSER::parseSectionVIA().

The documentation for this struct was generated from the following file: