KiCad PCB EDA Suite
ABOARD6_LAYER_STACKUP Struct Reference

#include <altium_parser_pcb.h>

Public Attributes

wxString name
 
size_t nextId
 
size_t prevId
 
int32_t copperthick
 
double dielectricconst
 
int32_t dielectricthick
 
wxString dielectricmaterial
 

Detailed Description

Definition at line 332 of file altium_parser_pcb.h.

Member Data Documentation

◆ copperthick

int32_t ABOARD6_LAYER_STACKUP::copperthick

Definition at line 339 of file altium_parser_pcb.h.

Referenced by ABOARD6::ABOARD6(), and ALTIUM_PCB::ParseBoard6Data().

◆ dielectricconst

double ABOARD6_LAYER_STACKUP::dielectricconst

Definition at line 341 of file altium_parser_pcb.h.

Referenced by ABOARD6::ABOARD6(), and ALTIUM_PCB::ParseBoard6Data().

◆ dielectricmaterial

wxString ABOARD6_LAYER_STACKUP::dielectricmaterial

Definition at line 343 of file altium_parser_pcb.h.

Referenced by ABOARD6::ABOARD6(), and ALTIUM_PCB::ParseBoard6Data().

◆ dielectricthick

int32_t ABOARD6_LAYER_STACKUP::dielectricthick

Definition at line 342 of file altium_parser_pcb.h.

Referenced by ABOARD6::ABOARD6(), and ALTIUM_PCB::ParseBoard6Data().

◆ name

wxString ABOARD6_LAYER_STACKUP::name

Definition at line 334 of file altium_parser_pcb.h.

Referenced by ABOARD6::ABOARD6(), and ALTIUM_PCB::ParseBoard6Data().

◆ nextId

size_t ABOARD6_LAYER_STACKUP::nextId

Definition at line 336 of file altium_parser_pcb.h.

Referenced by ABOARD6::ABOARD6(), and ALTIUM_PCB::ParseBoard6Data().

◆ prevId

size_t ABOARD6_LAYER_STACKUP::prevId

Definition at line 337 of file altium_parser_pcb.h.

Referenced by ABOARD6::ABOARD6().


The documentation for this struct was generated from the following file: